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Large scale and high density packaging of ASICs are usually achieved by FCBGA forms. The structure and materials are more complicated in FCBGA, which would cause reliability concerns in situations where thermo-mechanical stressing is dominant. Accelerated temperature cycling reliability test was performed on 90-nm/8-level copper based FCBGA packaging devices, and open failures dominated by thermo-mechanical...
The failure analysis from the manufacturer could not fully explain the Cu-Al bond open and drift issues in some plastic encapsulated microcircuits. For further investigation, an insight analysis containing chemical deprocessing, cross-sectioning and mechanical opening was performed to define the root cause. Several new findings were observed to support a reasonable cause. The corrosion reaction of...
ESD sensitive test was performed to verify the design of circuit protection unit. The failure ICs were analyzed by OBIRCH technique. Three anomalous thermally sensitive sites were localized including I/O and VCCIOs. OBIRCH analysis confirmed the failure sites were directly connect to the pads, mostly ESD protection units, decoupling capacitor and internal inverter. Physical failure analysis confirmed...
In older to show the failure phenomena of breakdown spot caused by a small energy voltage for metal-insulator-metal (MIM) capacitors failure analysis in GaAs integrated circuit, different methods of de-golding technology was discussed in this paper. A kind of de-golding solution was optimization with consideration of MIM capacitors' construction and material. Typical MIM capacitor failure analysis...
Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost, size, weight and product variety. However, PEMs are non-hermetic package and the plastic mold materials are inherently hygroscopic and absorptive, so the PEMs are permeability to moisture. Furthermore, the mismatch of coefficient of thermal expansion between the mould compound...
For the package size, weight and cost advantages, plastic encapsulated techniques have been widely used in the packaging industry. However, due to the inherent seal problem of the plastic materials itself and the mismatched coefficient of thermal expansion (CTE) between the epoxy moulding materials and the various interfaces, many reliability problems are worth of serious consideration. In this paper,...
Failure analysis (FA) plays an important role in semiconductor industry as the process technology and new packaging are continuously improved. Fault localization is a key step to narrow down the area of failed part and isolate the defective areas, which is prior to destructive failure analysis. This paper will cover some advanced fault localization techniques and tools in package and die/device level...
Grinding as one of the most important mechanical decapsulation methods is always used in plastic encapsulated devices failure analysis (FA). It has advantages in protecting failure site as compared to traditional chemical decapsulation methods, especially for some failure mechanisms such as silver electrochemical migration, metal corrosion, ionic contaminant, solder balls bridging, poor bonding, etc...
Plastic encapsulated microelectronics used in a large variety of applications offer significant advantages in terms of cost, size, weight and product variety. However, PEMs are non-hermetic package and the plastic mold materials are inherently hygroscopic and absorptive, so the PEMs are permeability to moisture. Furthermore, the mismatch of coefficient of thermal expansion between the mould compound...
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