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This paper describes the ongoing research and development at Amkor Technology of Chip-on-chip/Face to Face (CoC/F2F) technology being developed in parallel with Through Silicon Via (TSV) package assembly. Unlike other 3D packaging techniques using TSVs that require front end processing, CoC/F2F technology uses existing chip attach (C/A) or thermal compression (TC) equipment to connect each die — referred...
We observe that rectangular holes fabricated in a gold film with a sub-skindepth thickness show blue-shifted resonance frequencies as the width increases. For rectangular holes on a finite substrate its thickness and the hole width are crucial factors determining the resonance frequency.
In this paper, we present a novel electrostatic discharge (ESD) protection device which is, against the catastrophic ESD attack, activated as either a reverse-biased punchthrough bipolar junction transistor (BJT) or a forward-biased diode, depending on the polarity of the input pulse. Experimental data show that the new device is more efficient and area-effective than any other conventional one. It...
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