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Two different types of thermodynamically induced self-assembled hierarchical structures were formed in carbon black (CB)-filled POM/SAN/TPU and POM/SAN/PA6 ternary polymer blends when the minor third polymer components TPU and PA6, which have the highest affinity to CB among the three polymer components, were individually incorporated into CB-filled POM/SAN binary blend: TPU with imbedded CB forms...
A study of the direct preparation of hollow polymer nanocapsules which composed of the biocompatible and biodegradable polymers, polysaccharide and polylactic acid (PLA), was presented. By the dialysis of a DMSO solution of cholesterol-modified dextran (Chol-Dex) and poly(d,l-lactic acid) against water, hollow polymer nanocapsules with a highly stable structure and relatively narrow size distribution...
The bottom-up self-assembly fabrication process of nanoelectronic results in higher defect density. Furthermore, transient and permanent faults could also occur during operation due to the sensitivity. Thus, defect and fault tolerance techniques are urgently needed. In this paper, we propose a concept of diversity mapping and three corresponding algorithms for defect-tolerance logic mapping in nanoelectronic...
In addition to high defect density, serious variations exist in self-assembled nanoelectronic crossbar architectures compared to the conventional lithography-based CMOS integrated circuits. Therefore, it is one of the emerging challenges to tolerate variations apart from tolerating defects. In addition, considering many-sided factors simultaneously in variation tolerance is necessary. In this paper,...
Emerging nanoelectronic technologies are expected to extend the conventional integrated circuits beyond CMOS. However, the bottom-up self-assembly fabrication process of nanoelectronic devices results in higher defect density. Thus, crafted defect-tolerance techniques are urgently needed. In this paper, we present a low time complexity algorithm for application-independent defect-tolerance of nanoelectronic...
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