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Layered-medium integral-equation (LMIE) methods that can confront the multiscale problems encountered in electromagnetic modeling of electronic packages are presented. The methods include (i) an impedance-boundary condition (IBC) formulation for modeling conductor thickness, roughness, and finite conductivity, (ii) non-radiating lumped-port models for extracting network parameters, and (iii) FFT based...
The focus of this paper will present Charge Flow which is a workflow based approach to manage the issue of chargeback within a Cloud environment. This work has been driven by the need for both private and public cloud operators to manage their virtualized infrastructures to ensure proper accountability so that resource usage is metered, charged and billed to the respective user of the virtualized...
The location of the partial discharge source in transformer insulation was analysed by simulation studies. The partial discharge source was modelled such that it radiates the Ultra High Frequency (UHF) signal. It was observed that there exists a time difference of arrival of the UHF signal at the sensors based on its distance from the location of the partial discharge source. Also the magnitudes of...
The conducting metal filament formation process of a typical resistive switching memory is comprehensively studied using Kinetic Monte Carlo simulation, which includes multiple physical and chemical mechanisms. The characteristics of the forming voltage, forming time and the so called "Voltage-time dilemma" are investigated. In addition filament topographies, which strongly influence device...
FinFET technology presents a competitive alternative to planar CMOS as it features a better control of the short channel effects. This results in improved digital and analog performances. The radio-frequency (RF) behavior is however affected by a large level of parasitics. In this paper, we explain how technological options and device design affect the FinFET performance. In addition, the challenges...
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