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In this paper, we developed a 3-D thermal model of a modulator- and amplifier-integrated distributed feedback laser array with detailed heat sources based on finite element method. Thermoelectric cooler (TEC) power consumption in the laser array package was analyzed and we found that it was severe in high temperature environment. To reduce the TEC power consumption, circumstances of using different...
Thermal relaxation time can be critical in high speed optoelectronic devices. In this paper, a three-dimensional thermal model of a semiconductor laser package is developed by the finite element method. A proper designed proportion-integration-differentiation loop is designed for temperature managing. Factors affecting thermal relaxation time in the device are analyzed. Thermal time constant of thermistor...
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