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3D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a hybrid half-bridge in a 3D packaging configuration, dedicated for high voltage application. A dynamic electrical test of the package is presented.
Potential benefits of Integrated Motor Drives (IMD) include increase in power density, reliability and efficiency. These benefits are particularly valuable in Aerospace and Automotive applications. However, close physical integration of the drives and the machine may also lead to an increase in component temperature. This requires careful thermal analysis and coupled design of the IMD system. This...
Electric drives which are deployed in transport applications often have stringent volume/mass constraints requiring that the subsystems of electric drives are incorporated in a tightly packaged mechanical arrangement. As integration of mechanical and electronic subsystems becomes more intricate the thermal management issues relating to dealing with the loss in the converter and actuator in tandem...
This paper presents an investigation into the integration of high current density inductors into a double side cooled sandwich power module package from the perspective of thermal management of the integrated inductors. The advantage of using this integration method with regards to using the converter thermal management system will be discussed in order to create a high speed optimised commutation...
Historically, each discipline in power electronics has been pursued independently, and as a result, individual product classes, such as power modules, passive components, thermal management systems, gate drives and converters, have been developed without full consideration of the inter-component interactions. This serial approach to design and manufacture has reached its limit and further advances...
A novel double-side cooled power module is presented which delivers superior cooling performance with the potential for improved robustness to thermal cycling. The semiconductor dies are sandwiched between conventional DBC substrates, the substrates being directly cooled rather than through a conventional heat spreader heat sink assembly. A theoretical analysis is presented illustrating that direct...
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