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An application-oriented integration concept for a half-bridge switch assembly has been developed based on the latest generation 70- $\mu\hbox{m}$-thin insulated gate bipolar transistors and diodes, which are rated at 600 V/200 A. This paper addresses the design and reliability of the assembly, with a fully bondwireless approach using cylindrical copper bumps. Advanced numerical structural simulation...
Reliability analysis for three bumping configurations is performed under typical chip package interaction. A sequential submodeling technique is employed to capture stress evolution during entire package assembly process. Mechanical stresses are assessed in various regions around bumps to determine the optimal bumping scheme with the minimal reliability risk. Underfill material property impact on...
With the increasing demand for reduced package size and enhanced package performance, the semiconductor industry has intensified focus on the development of alternate technologies, resulting in significant interest in flip chip or direct chip attach (DCA) packages using copper pillar bump interconnects. In DCA packages, the coefficient of thermal expansion (CTE) mismatch between different materials...
We discuss the mechanical and thermal design of a high temperature pressure-mounted base-plate-less power module for application in a continuous high temperature (150°C) ambient.
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