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Nanowire ACF is fabricated by template synthesis method based on electrochemical deposition. Due to the high aspect ratio of length to diameter (50∶1), the nanowires can act as compliant conductors to electrically connect the bumpless dies with a small bonding force. In this work, an interconnection resistance of 90 mΩ per 40 × 40 µm2 pad is measured for the Cu NW-ACF bonding between two Au bumpless...
In this paper, Cu nanowire based anisotropic conductive film (ACF) has been systematically investigated in terms of its fine-pitch potential, electrical/ mechanical properties, process related issues and failure mechanisms. A test chip module including daisy-chain and 4-point structures was fabricated by electroplating and photolithography process, which has 160, 80, 40 and 30 μm bond pad pitches...
In this paper, the assessment of the electrical and mechanical performance of the Cu nanowire anisotropic conductive film (NW-ACF) flip-chip interconnects has been performed. The influence of bonding conditions (bonding temperature and bonding force) has been studied in order to understand their impact on bonding resistance and shear strength for two types of NW-ACF based on different templates with...
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