The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper introduces test solutions for Integrated Fan Out Wafer Level Chip Scale Packaging (InFO WLCSP) which has the promising of being a very cost effective solution to achieve “More than Moore's law” for mobile devices — more so than 3D integrated circuits (3DIC). InFO WLCSP has its own unique test challenges and it is important to have high-quality screen methodology for severe defects and potential reliablity failures. In this paper we propose novel solutions that leads to fast and reliable tests for InFO WLCSP packages. We will show results on some industrial cases to validate our claims.