The cross-point architecture for memory arrays is widely considered as one of the most attractive solutions for storage and memory circuits thanks to simplicity, scalability, small cell size, and consequently high density and low cost. Cost-scalable vertical 3-D cross-point architectures, in particular, offer the opportunity to challenge Flash memory with comparable density and cost. To develop scalable cross-point arrays, however, select devices with sufficient ON–OFF ratio, current capability, and endurance must be available. This paper presents a select device technology based on volatile resistive switching with Cu and Ag top electrode and silicon oxide (SiOx) switching materials. The select device displays ultrahigh resistance window and good current capability exceeding 2 MAcm−2. Retention study shows a stochastic voltage-dependent ON–OFF transition time in the ${10}~\mu \text{s}$ –1 ms range, which needs to be further optimized for fast memory operation in storage class memory arrays.