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In order to improve tool productivity in semi-conductor manufacturing, we come up with this work reporting a combination of Wait Time Waste (WTW) and Hidden Capacity Diagnostic (HCD) analysis methodology to extract the wafer process information from tool log via SEMI standard and SECS data to do visualization analysis. Thereafter, it is easier to find opportunity to reduce unnecessary process waste...
Advanced process controls (APC) have been ubiquitously applied to the manufacturing processes of semiconductor devices for over two decades by now. Reports on its successful applications to the makings of light-emitting diodes (LED) in the solid-state lighting (SSL) industry however are comparatively less well documented in the literature [1-4]. The concluding remark in [1], ‘…APC is not yet reality...
The monitoring mechanism uses in-line data which is conservative stratification and grouping to calculation %Bias. (%Bias=bias/process variation.) It represents tools are significant difference when %Bias>10% referring to MSA 2nd manual. As each tool is too stable, the influence of variation would be so sensitive, and the mechanism would be too strict. We developed if we combined %Bias criteria...