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The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the...
Apart from its chemical structure, mechanical properties of polymers depend mainly on polymer morphology, which is determined by the processing conditions. Exposure of the materials at elevated temperatures lead to changes in polymer morphology. The main objective of this study was to investigate the change in thermo-mechanical properties of different encapsulation materials (EVA, Ionomer) after damp...
Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
This research work presents the scientific approach used to qualify polymers for airborne power electronic packaging. Three types of polymer were studied, each of them having to fulfil specific function in a power module. Firstly, four high temperature polymers were pre-selected for external housing and their properties were investigated in two model ageing environments. Very different ageing mechanisms...
Epoxy molding compound (EMC) is a common material used in IC packaging. One of its defects is warpage. Warpage could be a serious issue for some IC encapsulation processes. To alleviate the warpage problem during encapsulation, post mold cure process (PMC) is the most common strategy used. However, there are still no adequate tools or models to simulate the post mold cure process. Since EMC behaves...
Silica-filled epoxy composites represent an important class of electronic packaging materials. In this paper, a series of semi-empirical equations are proposed for estimating the density, temperature-dependant modulus, expansion coefficient and Poisson's ratio of silica-filled epoxy composites as a function of the silica content and glass transition temperature. The density and expansion coefficients...
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