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The mechanical properties of polymer encapsulating materials change considerably when packages are exposed to elevated temperatures for longer times. Here we report a systematic study on the change in viscoelastic properties of a commercial molding compound which is stored at 175°C for periods of time ranging up to 4 weeks. It is shown that instead of the expected degradation, the modulus and the...
The distribution and diffusion of water with various water content in a fully crosslinked epoxy molding compound was simulated using a parallel full-atomistic molecular dynamics simulation method. We found that the free volume is 5.1%, 4.4%, and 4.0% of the total system volume at 0 wt%, 4 wt%, and 7 wt% of water content, respectively, accommodating the absorbed water molecules, where the molecules...
Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
In recent years, combining a ferroelectric ceramic and a polymer matrix to form a flexible composite with coupling properties in between that of two individual phases has been pursued for sensors in medical applications and hydrophones. For hydrophone applications, a useful piezoelectric material should have high piezoelectric voltage coefficient (g33), piezoelectric strain coefficient (d33) and high...
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should be available,...
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