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The aged polymer modified asphalt (abbreviated as PMA) was recycled with two methods which were adding fresh PMA and adding recycling agent to investigate the recycling characteristics of PMA. The performance of the recycled PMA was evaluated systematically with a variety of indices, including penetration, softening point, ductility, viscoelasticity and stiffness. The results indicate that the performance...
The smash technology is widely used in the post process working procedures of raw materials in the high polymer fabrication plants. The research on the fracture mechanism of rubber and the corresponding equipments is very useful for the reduction of energy consumption and increasing of production efficiency. Based on the introduction of physical characteristics and fracture features of rubber, the...
Thermosetting polymers are widely used in electronic industry as encapsulants of electronic devices. It is well known that properties of polymers and polymer-based composites like molding compounds are highly dependent on conditions like: temperature, time, humidity, degree of cure etc. These effects are investigated extensively in the past. Surprisingly, the effect of postcure and thermal aging on...
An ongoing root cause of failure in microelectronic industry is interface delamination. In order to explore the risk of interface damage, FE simulations for the fabrication steps as well as for the testing conditions are generally made in the design stage. In order to be able to judge the risk for interface fracture, the critical fracture properties of the interfaces being applied should be available,...
The use of temperature and time dependent material parameters is state-of-the-art in mechanical engineering. An advanced measurement method for the determination of moisture dependent parameters for micro and nano scale samples was developed. In combination with FE-analysis, this tool (involving time, temperature, and humidity) ensures a sure deployability. The present paper deals with the influence...
Epoxy molding compound (EMC) is a common material used in IC packaging. One of its defects is warpage. Warpage could be a serious issue for some IC encapsulation processes. To alleviate the warpage problem during encapsulation, post mold cure process (PMC) is the most common strategy used. However, there are still no adequate tools or models to simulate the post mold cure process. Since EMC behaves...
A finite element simulation tool for thermal imprint process has been developed. In the system, polymer is assumed to be a visco-elastic body represented by the generalized Maxwell model. We experimentally measured visco-elastic properties of a polymer material and derived parameters used in the simulation tool. Using the same polymer material, we performed imprint experiments to examine time and...
Silica-filled epoxy composites represent an important class of electronic packaging materials. In this paper, a series of semi-empirical equations are proposed for estimating the density, temperature-dependant modulus, expansion coefficient and Poisson's ratio of silica-filled epoxy composites as a function of the silica content and glass transition temperature. The density and expansion coefficients...
A sandwich composite approach has been employed to develop epoxy based polymer matrix composite materials to realize a class of lightweight structures capable of shielding electromagnetic interference (EMI). Hollow glass microspheres embedded syntactic foams (thickness ap 2 mm; density ap 0.6 g/cc) of two different varieties have been used as core materials in these sandwich constructions (total thickness...
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