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We have developed mechanically soft and conformable light emitting diode (LED)-implemented fabric for the applications to the three dimensionally complicated shapes of furniture, tents and ceilings by transforming the shape of the lighting fabric. The developed LED fabric is assembled by the process in which the LED-mounted 5 × 20 mm pieces of printed circuit board (PCB) is firstly soldered to 2 cm...
In this paper, a multi-conductor transmission line (MTL) model of a spacecraft harness is presented. Some of the practical issues that occur in the modeling process are discussed, and typical values of the model parameters for a particular example are given. Finally, the model results are validated with measurements.
The classical wire bonding has several drawbacks that make 3D structures a desirable technology for a high performance power module. An interconnection solution for the power semiconductor dies is presented here: it is based on copper micro-posts that are electroplated on top of the die. The die with its micro-posts is then assembled between two Direct Bonded Copper (DBC) substrates using a direct...
Various cooling structures suitable for integrated water cooling including pin fin, folded and bonded structures have been compared. A jointing method has been presented, that allows the reliable mounting of substrates onto aluminium structures. A demonstrator with a cooling structure was manufactured and its reliability was tested.
Historically Cu wire has been targeted to lower pin count high power discrete devices and consumer product for a long time. As gold costs increased the industry started focusing on moving more mainstream products to Cu wire. Markets that have seen the largest growth in Cu wire bonded products include consumer electronics, communication devices and industrial electronics etc. However, Cu wire has been...
Currently, most industrial power modules, even IPEMs (Intelligent Power Electronics Modules), are interconnected in a planar way, and interconnections are made with bonding wires. This paper presents a three dimensional interconnection solution based on the idea to flip chip the gate driver directly on the surface of the power device, simplifying and optimizing the packaging and the interconnections...
Direct copper bonded (DBC) bottom die substrate attachment is usually ensured by solder joints but with regard to reliability it remains the weakest component of the package. The sustained trend for high power density requires new interconnection technologies. Nanowires seem to be a promising candidate for interconnection applications in power electronics and microelectronics. This paper presents...
This paper presents a process of making a solder-less element for mechanical and electrical interconnection using copper nano wires. It consists in a structure of nano-posts, which are deposited on two different metal surfaces by copper electroplating through a porous alumina membrane. Electrical and mechanical interconnection is then achieved by pressing the surfaces against each other leading to...
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