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Sn-Ag-Cu (SAC) and Sn-Ag alloys are considered to be the most promising Pb-free solders for electronics applications. The properties of these solders can be improved by the addition of minor alloying elements to control the intermetallic compounds (IMCs) that are formed during soldering and high temperature storage/cycling. Additional alloying elements into the solder alloys change the solidification...
In this work, the SAC solder joints with minor Mn or RE (rare earth) additions were bonded on the substrate of OSP Cu surface finishes for evaluating the influence of minor alloying on BIT (ball impact test) behavior. The Mn-doped samples had a better resistance to the degradation in BIT performance suffering long time aging at 150??C. The greater impact force and toughness compared to the other samples...
It is of importance for the reliability of lead-free and lead-bearing solder joints to have better understanding and control of the solder/metallization interactions during soldering. In the reactions between solders and Cu substrate, the formation of micro voids within the Cu3Sn layer had been report by many research groups. Because the Cu3Sn growth had been linked to the formation of micro voids,...
The objective of this study is to investigate the alloying effects of Fe, Co, and Ni on the interfacial reactions between solder and Cu. Emphasis is placed on a systematic comparison study on the effect of Fe, Co, and Ni additions. Solders with simultaneous Fe and Ni addition as well as simultaneous Co and Ni addition are also prepared in order to investigate whether there is any interaction between...
It is gradually recognized that Sn-Ag-Cu is better alloy system for application prospect in the lead-free solders. In order to cut down the cost and improve properties, researchers have always been searching for proper compositions and adding elements to improve properties actively. This paper has investigated the effect of Ni addition on Sn-0.3Ag-0.7Cu (SAC0307) low-Ag solder joint. The results of...
Zn was added into Sn-Bi solder to investigate the effect of Zn on the microstructure of the alloy. Zn addition was found to refine and redistribute the Bi-rich phase. With Zn addition, a different intermetallic compound, Cu5Zn8 was formed at the Sn-Bi-Zn/Cu interface upon reflow. After aging, the Bi segregation was not observed at the Sn-Bi-Zn/Cu interface while a continuous Bi segregation layer appeared...
The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solder were prepared by adding 0-1.0 wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150degC for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged solder/copper...
The solders used for this study are Sn2.5Ag0.8Cu doped with 0.03 wt.% Fe, Co, or Ni and 0, 0.005, 0.01, 0.06, or 0.1 wt.% Ni. Reaction conditions included multiple reflows for up to 10 times and solid-state aging at 160degC for up to 2000 hrs. In multiple reflow study, Cu6Sn5 was the only reaction product observed for all the different solders used. Reflows using the solder without doping produced...
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