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Although lead free soldering has been the main stream of industry since 2006, with the replacement of eutectic SnPb system by SnAgCu system, the development of drop-in lead-free alternatives for high melting high lead solder alloys is still far from mature. BiAg alloy exhibits acceptable bulk strength but very poor ductility and wetting, therefore is not acceptable as an option. In current work, a...
This paper investigated the individual effects of thermomigration behavior in Cu/Sn58Bi/Cu solder joints by applying a pure thermal gradient field at an ambient temperature of 20°C. To separate electromigration behavior, a novel apparatus was used to carry out the thermomigration experiment. The thermal finite-element simulation results showed that a sufficient thermal gradient existed in the Cu/Sn58Bi/Cu...
The mechanical properties and interfacial microstructure of Cu/Sn3Ag0.5Cu3Bi0.05Cr/Cu (Cu/SACBC/Cu) and Cu/Sn3.0Ag0.5Cu/Cu (Cu/SAC/Cu) joints were comparatively investigated after isothermal aging at 85 °C, 120°C and 150°C for 24, 168, 500 and 1000 h, respectively. The mechanism of Bi addition affecting the intermetallic compounds (IMCs) growth was discussed. Results show that the tensile strength...
Bi element addition effects on Sn-0.3Ag-0.7Cu low-Ag solder properties are studied in this work. Solder alloy with different Bi adding amount, Sn-0.3Ag-0.7Cu-XBi (X = 0, 1.0, 3.0, 4.5), were fabricated. The melting point, wettability, and strength tests were carried out to find the effects of Bi addition on current low-Ag solder. Thermal aging of the solder interconnects with different Bi addition...
Zn was added into Sn-Bi solder to investigate the effect of Zn on the microstructure of the alloy. Zn addition was found to refine and redistribute the Bi-rich phase. With Zn addition, a different intermetallic compound, Cu5Zn8 was formed at the Sn-Bi-Zn/Cu interface upon reflow. After aging, the Bi segregation was not observed at the Sn-Bi-Zn/Cu interface while a continuous Bi segregation layer appeared...
84Sn-3Ag-3Bi-10In and 89Sn-3Ag-3Bi-5In solders were subjected to reflow and solid state aging. The intermetallic compounds that formed at the interfaces between the solders and the Cu substrates and those that formed in the bulk solders in both test conditions were investigated. In the as-reflow samples, the intermetallic compounds were identified as Cu3Sn and Cu6Sn5. After solid state aging, these...
In this paper, the interfacial reactions of Sn-8Zn-3Bi and Sn-8Zn-3Bi-0.3Cr solders with Cu pads and the growth of IMCs during long-term aging treatment were presented and discussed. Less than 3 mum Cu5Zn8 IMC layer was found at the Sn-8Zn-3Bi-(0.3)Cr/Cu during the reflow at 230degC for 1 min. During solid state aging treatment at 150degC for 4, 9, 16, 25 days, the Cu5Zn8 IMC grown up with the extension...
Transmission electron microscopy (TEM) observations were carried out to investigate the microstructural evolution of SnBi/single crystal (100) Cu interface during reflow and solid-state aging process. It was found that there were two kinds of IMCs, Cu6Sn5 and Cu3Sn, at the interface after reflow. The Cu3Sn grains grew along [100] direction of Cu with columnar morphology. During aging, new triangle...
The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393 K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid...
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