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With the rapid development of the electronic industry, electronic products tend to be small, lightweight and high density, the demand of flexible copper clad laminate (FCCL) is increasing every year. Peel strength is a key property for FCCL. This paper studies the effect of heat/humidity treatment on the adhesion strength of FCCL. The results show that the original peel strength of FCCL was high in...
The growth of intermetallic compounds (IMC) at the Sn3.0Ag0.5Cu/Cu interface is investigated under aging temperature of 150 °C and aging time of 100, 300 and 500 hours. The relationship between the thickness of the IMC and aging time is fitted out, and the growth law of the IMC at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition is obtained. Mechanical properties of the Cu6Sn5 and Cu3Sn...
Gold and copper ball bonds were isothermally aged under moist conditions (85°C and 85% relative humidity (RH)) and wet conditions (85°C in DI water with and without NaCl) in an effort to better understand the corrosion mechanisms that operate under moist and wet conditions. The objective of this work is to undertake and report on the initial stages of a research project that aims to compare the performance...
One of the main drawbacks of silver-filled isotropically conductive adhesives (ICAs) is the high cost of silver fillers, while low cost copper-filled ICAs are not reliable due to the oxidation of copper fillers. In this paper, we develop highly conductive, highly reliable, and low cost ICAs filled with silver-coated copper (Ag-coated Cu) flakes, i.e. an anhydride-cured ICA filled with Ag-coated Cu...
Copper and gold ball bonds were bonded on 1.2 μm thick Al-0.5%Cu-1%Si. One set of devices was aged at 175°C up to 1000 hours. A second set of devices was pre-conditioned for 168 hours at 85°C and 85% relative humidity followed by ageing at 175°C up to 1000 hours. No cratering was found with either wire in as-bonded devices but devices bonded with copper developed cratering after ageing. Neck and stitch...
The current study revealed that the growth kinetics and the interfacial reaction of the Cu/Sn/Ag couples with different thickness solder. For the Cu/Sn/Ag couples, plate-type Ag3Sn was firstly formed at the Sn/Cu interface rather than at the Sn/Ag interface for the Cu/Sn/Ag couple at the initial state of the reflow procedure when the solder thicknesses is 150 μm or 300 μm. Besides, the microstructure...
In the present study, the interaction between thin film Cu and non-eutectic Sn-In is studied. The effects of the bonding and aging temperature on microstructure, IMC formation and also shear strength are investigated by SEM/EDX, XRD and shear testing. The bonding mechanism is proposed based on the obtained results. The bonding mechanism is proposed to occur over 2 stages: (1) An increase in bonding...
The formation and growth of intermetallic compound layer thickness is one of the important issues in search for reliable electronic and electrical connections. Intermetallic compounds (IMCs) are an essential part of solder joints. At low levels, they have a strengthening effect on the joint; but at higher levels, they tend to make solder joints more brittle. If the solder joint is subjected to long-standing...
The relationship among the electrical resistance, the thickness of the IMC layer and the aging timer of the micro SOH solder joints is investigated in present paper. It's found that the composition of compositions of the intermetallic compounds are Cu3Sn near the Cu side and Cu6Sn5 near the solder side; With the increasing of aging time, the thickness of the Cu3Sn increased while the thickness of...
Due to the miniaturization trend and functional demand in high-density microelectronic packaging, the thermomigration in flip chip solder joints owing to the joule heating becomes a serious reliability issue. In this study, a novel apparatus which can provide a sufficient temperature gradient cross the solder joint in the specimen was used to carry on the thermomigration experiment separated from...
Reballing involves removing the original solder balls and attaching new solder balls on the pads of ball grid array components. In this study, 676 I/O BGAs with Sn3.0Ag0.5Cu (SAC305) balls were reballed with eutectic tin-lead solder. The original metallization of the pads on the BGAs was Cu/Ni with immersion Au. Two solder ball removal methods were applied: the low-temperature wave solder method and...
In this paper, the effect of SiC nano-particles in micro-solder bump was investigated. SiC nano-particles were dispersed by using ultrasonic homogenizer in plating solution of eutectic Sn58Bi solder and codeposited in eutectic Sn58Bi solder bumps. Solder bumps were fabricated on patterned wafer. Prepared samples were aged for 100, 256 and 400 hrs at 100??C respectively, and then the observation of...
In this study, Sn3.0Ag0.5Cu solder bump was jointed on Ni(V)/Cu UBM and then aged at 125 degC for 500-2000 h. The heat treatment samples were employed to investigate the interfacial reaction and the mechanical properties between solder and UBM. (Cu,Ni)6Sn5 IMC formed at the interface between solder and Ni(V) layer after assembly. The thickness of (Cu,Ni)6Sn5 gradually increased to 4 mum during aging...
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