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The butting solder joint of Cu/Sn-3.0Ag-0.5Cu/Cu was used to investigate the evolution of the intermetallic compound (IMC) and the degradation of the tensile strength of solder joint in this paper with different electromigration and aging time by scanning electron microscopy equipped with energy dispersive spectrometer and micromechanical testing. Meanwhile, the fracture of solder joint was also evaluated...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated using the lap-shear test. The experimental results show that the thickness of intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing standoff height of the joints. The size of Kirkendall...
Much literature has been written and debated on the effects of reflow profiles on IMC {Inter-metallic compound) formation for solder alloys and the diffusion of elements during this process. This data has been concerning primarily assembly operations. However, not much data has been acquired on the effects of thermal aging on solders at back end pre-pack operations. The thermal aging conducted at...
This study utilized out high speed lap-shear tests at various strain rates (0.01 mm/s ~ 500 mm/s) for Sn-37Pb/Cu and Sn-37Pb/ENIG solder joints to evaluate the drop reliability. The samples aged for 120 h at different temperatures (150??C and 170??C) were also tested to examine the effects of aging on the drop reliability. We thoroughly analyzed the stress-strain curves obtained from the lap-shear...
The reliability of lead free electronic devices depends strongly on the reliability of the soldered joints while the later one was controlled, mainly, by the formation and growth of the interfacial intermetallic compounds (IMCs) between the solder matrix and the substrates. The morphological features, microstructural evolutions and growth kinetics of the IMCs on the interfacial of SnAgCu/Cu soldered...
To meet the urgent demands of future electronic packages, the solder joints have to become increasingly miniaturized. Compared to the large solder joints, mechanics behavior for the samll solder joints is very different, resulting in a series of reliability issues. Therefore, it is very important to understand the mechanics behavior of the small solder joints. In this paper, the shear test of the...
To enhance the ability of lead-free solder joint to resist failures induced by mechanical impact and shock, some researchers have introduced low-Ag lead-free solder. In this study, the formation and evolution of IMC, the fracture morphology and performance of solder joint between SAC 105 solder and Under Bump Metallization (UBM) have been studied after different temperature storage aging and multi-reflow...
We recently developed Cu-Zn alloy wetting layer for the SAC solder balls to improve the reliability. In this paper, IMC formation and solder joint reliability have been investigated in the solder joint between SAC solder balls and Cu-Zn alloy pads, and Cu pads were also used as a reference. Sn-4.0Ag-0.5 Cu solder balls were used and the substrates were Cu and 80 wt% Cu-20 wt% Zn pads which were defined...
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