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For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch <; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening due to the combined effect of thermal and mechanical stimuli during service and storage. This results in evolution of joint properties over time, and thereby influences the long-term reliability of microelectronic packages. Accurate prediction of this aging behavior is therefore critical for joint reliability predictions...
Electroplated copper is becoming increasingly important in UBM (under bump metallurgy). The Cu is used as a wetting material for the solder (ball). After reflow the Cu and solder joints are the main contact method for mechanical and electrical interconnection to the pads of the chip. One of the critical factors affecting solder joint reliability is the formation of intermetallic compound (IMC); that...
There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical properties. Cu bonding wires, in general, are severely limited in their use compared to Au wires; such as wire oxidation, lower bondability, forming gas of N2+5%H2, and lower reliability. It is difficult for conventional bare Cu wires to achieve the target of LSI application...
IC performance and cost drive interconnect dimensions to shrink to ever-smaller sizes the RC delay becomes the dominant factor to impact IC performance. The RC delay is a function of the product of the total resistance and capacitance of the whole interconnects structure. To reduce RC delay, copper interconnects were introduced to replace aluminum. At the same time, the low K material has been widely...
In this study, Sn3.0Ag0.5Cu solder bump was jointed on Ni(V)/Cu UBM and then aged at 125 degC for 500-2000 h. The heat treatment samples were employed to investigate the interfacial reaction and the mechanical properties between solder and UBM. (Cu,Ni)6Sn5 IMC formed at the interface between solder and Ni(V) layer after assembly. The thickness of (Cu,Ni)6Sn5 gradually increased to 4 mum during aging...
In this paper, the interfacial reactions of Sn-8Zn-3Bi and Sn-8Zn-3Bi-0.3Cr solders with Cu pads and the growth of IMCs during long-term aging treatment were presented and discussed. Less than 3 mum Cu5Zn8 IMC layer was found at the Sn-8Zn-3Bi-(0.3)Cr/Cu during the reflow at 230degC for 1 min. During solid state aging treatment at 150degC for 4, 9, 16, 25 days, the Cu5Zn8 IMC grown up with the extension...
In the present work, Kirkendall void formation and drop impact reliability between Pb-free solder and Cu metallization were investigated. Pb-free solders, Sn-3.5 Ag and Sn-3.5 Ag-xZn (x=0.1, 0.5, 1, 3, and 7 wt%), were reacted with Cu metallization. After thermal aging of Sn-Ag solder on electrodeposited Cu at 150degC, Kirkendall voids were distributed either in the Cu3Sn layer or at the Cu/Cu3Sn...
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