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The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
The copper substrates with different preferred orientations (200) and (220) were prepared and the interfacial reactions of the Cu(200)/Sn and Cu(220)/Sn diffusion couples were studied after annealing at 423K. The thickness and morphology of the intermetallic compounds were investigated. The appearance of the Cu3Sn was observed at Cu(220)/Sn interface after aged for 4 hours and then the thickness of...
In this paper, the formation and growth of intermetallic compounds (IMCs) of Sn-8Zn-3Bi-0.3Cr solder on Cu, Ni and Ni-W substrates have been investigated. For the Cu substrate, only Cu5Zn8 intermetallic compound was observed. For the Ni substrate, a Ni5Zn21 film formed at the interface due to the fast reaction between Ni and Zn. For the Ni-W substrate, a thin Ni5Zn21 film appeared between the solder...
Sn-Ag-Cu (SAC) and Sn-Ag alloys are considered to be the most promising Pb-free solders for electronics applications. The properties of these solders can be improved by the addition of minor alloying elements to control the intermetallic compounds (IMCs) that are formed during soldering and high temperature storage/cycling. Additional alloying elements into the solder alloys change the solidification...
The objective of this study is to investigate the alloying effects of Fe, Co, and Ni on the interfacial reactions between solder and Cu. Emphasis is placed on a systematic comparison study on the effect of Fe, Co, and Ni additions. Solders with simultaneous Fe and Ni addition as well as simultaneous Co and Ni addition are also prepared in order to investigate whether there is any interaction between...
Pure Sn, Sn-0.7Cu, Sn-1.5Cu and Sn-3.0Cu solder joints were fabricated by a laser reflow soldering method, and then they were aged at 125degC for various periods. After 600 hours treatment, we found that thickness of Intermetallic Compounds (IMCs) in the pure Sn solder joints was 54mum. However, in the solder joints with Cu addition, formation of AuSn4 IMCs was inhibited, and other two kinds of Sn-Cu-Au...
The effects of added Cu into Sn-9Zn solder reacting with an Au substrate at 160degC for 24 hours were investigated in this study. The intermetallic compound (IMC) evolution sequences at the (Sn-9Zn)+xCu/Au interface and solders were : (i) (Au3 Zn7 + AuZn2 + AuZn) and Au3 Zn7 phases at the Sn-Zn/Au couples; (ii) (Au3 Zn7 + AuZn), (Au,Cu)3Zn7 phases, as x (the Cu content) was 1 wt%; (iii) AuSn and Cu...
In this paper, the interfacial reactions of Sn-8Zn-3Bi and Sn-8Zn-3Bi-0.3Cr solders with Cu pads and the growth of IMCs during long-term aging treatment were presented and discussed. Less than 3 mum Cu5Zn8 IMC layer was found at the Sn-8Zn-3Bi-(0.3)Cr/Cu during the reflow at 230degC for 1 min. During solid state aging treatment at 150degC for 4, 9, 16, 25 days, the Cu5Zn8 IMC grown up with the extension...
In the present work, Kirkendall void formation and drop impact reliability between Pb-free solder and Cu metallization were investigated. Pb-free solders, Sn-3.5 Ag and Sn-3.5 Ag-xZn (x=0.1, 0.5, 1, 3, and 7 wt%), were reacted with Cu metallization. After thermal aging of Sn-Ag solder on electrodeposited Cu at 150degC, Kirkendall voids were distributed either in the Cu3Sn layer or at the Cu/Cu3Sn...
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