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Intermetallic compound (IMC) plays great roles in connecting components to PCB boards, as well as die attach materials connecting chips to substrates. Cracks in IMC may leads to failure in an electronic product function. Therefore it is important to investigate the mechanical properties of the IMC to ensure the reliability of the solder joints. In this paper, a nanoindentation test was performed at...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints. It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions. In this paper, mechanical properties of two...
The microstructual stability of Sn-8Zn-3Bi/Cu and Sn-8Zn-3Bi-0.3Cr/Cu joints has been investigated under 85 °C temperature and 85% humidity conditions as a function of exposure time. The evolution of interface and near surface cross-sectional microstructures during exposure has been examined. A continuous single layer of intermetallic compound (IMC, hereafter) appears in both of the two kinds of solders...
Sn-Ag-Cu (SAC) and Sn-Ag alloys are considered to be the most promising Pb-free solders for electronics applications. The properties of these solders can be improved by the addition of minor alloying elements to control the intermetallic compounds (IMCs) that are formed during soldering and high temperature storage/cycling. Additional alloying elements into the solder alloys change the solidification...
Electroplated copper is becoming increasingly important in UBM (under bump metallurgy). The Cu is used as a wetting material for the solder (ball). After reflow the Cu and solder joints are the main contact method for mechanical and electrical interconnection to the pads of the chip. One of the critical factors affecting solder joint reliability is the formation of intermetallic compound (IMC); that...
Zn was added into Sn-Bi solder to investigate the effect of Zn on the microstructure of the alloy. Zn addition was found to refine and redistribute the Bi-rich phase. With Zn addition, a different intermetallic compound, Cu5Zn8 was formed at the Sn-Bi-Zn/Cu interface upon reflow. After aging, the Bi segregation was not observed at the Sn-Bi-Zn/Cu interface while a continuous Bi segregation layer appeared...
The atom diffusion and growth behavior of intermetallic compound (IMC) at Sn3.5Ag0.5Cu/Cu interfaces under isothermal aging and thermal-shearing cycling conditions were investigated. The results show that the morphology of Cu6Sn5 IMCs formed at Sn3.5Ag0.5Cu/Cu interface changed gradually from scallop-like to chunk-like, and IMCs thickness developed with the isothermal aging and thermal-shearing cycling...
Much literature has been written and debated on the effects of reflow profiles on IMC {Inter-metallic compound) formation for solder alloys and the diffusion of elements during this process. This data has been concerning primarily assembly operations. However, not much data has been acquired on the effects of thermal aging on solders at back end pre-pack operations. The thermal aging conducted at...
In this paper, the effect of SiC nano-particles in micro-solder bump was investigated. SiC nano-particles were dispersed by using ultrasonic homogenizer in plating solution of eutectic Sn58Bi solder and codeposited in eutectic Sn58Bi solder bumps. Solder bumps were fabricated on patterned wafer. Prepared samples were aged for 100, 256 and 400 hrs at 100??C respectively, and then the observation of...
SnPb solder joints are an essential part for microelectronic packages manufacturing industrial for a long time. In recent year, environmental concerns and RoHS (Restriction of Use of Hazardous Substances) has demanded elimination of lead from electronics products by July 1, 2006. However, base on increasing pressures to achieve environmentally friendly electronic materials and processes, and indeed,...
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