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Microstructure evolutions of as-reflowed and aged electroplated Cu/Sn/Cu sandwich structure with 20 or 40μm Sn layer have been investigated. Cu3Sn was observed at lower side of Cu/Sn/Cu structure with 40μm Sn layer after isothermal aging treatment for 24 hours, as for that structure with 20μm Sn layer, Cu3Sn appeared after aging for 48 hours. Regardless of Sn volume, the thickness of the blanket Cu...
This study was concerned on the growth behavior and the size characteristics of the interfacial intermetallic compounds (IMCs) between solder and Cu substrates during isothermal aging. Through the analysis of the 3D volume, 2D area, and the thickness of the IMC, a scientific method of characterization of the IMC's thickness size was found. That is using the image analysis software to calculate areas(S)...
The growth of intermetallic compounds (IMC) at the Sn3.0Ag0.5Cu/Cu interface is investigated under aging temperature of 150 °C and aging time of 100, 300 and 500 hours. The relationship between the thickness of the IMC and aging time is fitted out, and the growth law of the IMC at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition is obtained. Mechanical properties of the Cu6Sn5 and Cu3Sn...
In this study, varying amounts of Ni-CNTs were incorporated into the Sn-Ag-Cu matrix to form the composite solders. The interfacial intermetallic thickness formed on the Ni/Au metallized Cu substrate was determined under the as-soldered and isothermally aged (at 150°C for up to 42 days) conditions. The results of the interfacial intermetallic thickness showed that for the case of the unreinforced...
The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated using the lap-shear test. The experimental results show that the thickness of intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing standoff height of the joints. The size of Kirkendall...
Reballing involves removing the original solder balls and attaching new solder balls on the pads of ball grid array components. In this study, 676 I/O BGAs with Sn3.0Ag0.5Cu (SAC305) balls were reballed with eutectic tin-lead solder. The original metallization of the pads on the BGAs was Cu/Ni with immersion Au. Two solder ball removal methods were applied: the low-temperature wave solder method and...
The atom diffusion and growth behavior of intermetallic compound (IMC) at Sn3.5Ag0.5Cu/Cu interfaces under isothermal aging and thermal-shearing cycling conditions were investigated. The results show that the morphology of Cu6Sn5 IMCs formed at Sn3.5Ag0.5Cu/Cu interface changed gradually from scallop-like to chunk-like, and IMCs thickness developed with the isothermal aging and thermal-shearing cycling...
The changes of morphology and growth tropism of inter-metallic compound (IMC) and IMC growth rate at lead-free solders/Cu interface of solder joints often limit the reliability of the entire package during service. Furthermore, during thermal-shearing cycling process, the thickness of IMC at the interface grows significantly and growth tropism of IMC changes, resulting in in-service evolution of the...
The reliability of lead free electronic devices depends strongly on the reliability of the soldered joints while the later one was controlled, mainly, by the formation and growth of the interfacial intermetallic compounds (IMCs) between the solder matrix and the substrates. The morphological features, microstructural evolutions and growth kinetics of the IMCs on the interfacial of SnAgCu/Cu soldered...
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