The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
In high power automotive electronics copper wire bonding is regarded as most promising alternative for gold wire bonding in 1st level interconnects and therefore subjected to severe functional requirements. In the Cu-Al ball bond interface the growth of intermetallic compounds may deteriorate the wire bond. The thermo-mechanical properties of these intermetallic compounds are crucial in the prediction...
For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch <; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
High gold prices have led to renewed interest in replacing gold with copper in existing packages and new packages in order to save costs. Although reliability is often cited as a reason for using copper, the main driving force for its use is undoubtedly cost. Perceptions that copper wire is more reliable are based on the notion that the intermetallics grow more slowly and that thinner intermetallics...
Copper (Cu) wire bonding is getting more common as interconnections on aluminium (Al) bond pad metallization in microelectronics due to lower cost compared to gold wire bonding. The Cu-Al intermetallic compounds (IMC) growth in Cu ball bonds has been investigated by many researches but the understanding of the IMC phases is still incomplete and the impact to bond reliability know-how is limited. This...
Currently, there is a great interest in applying copper material to wire bonding of fine pitch assembly packaging particularly to improve reliability through minimizing the deterioration of bonded ball shear strength after thermal aging as well as cost saving purposes. However, since copper is much harder than gold, coupled with the work hardening effect of the USG power and force during wire bonding...
IC performance and cost drive interconnect dimensions to shrink to ever-smaller sizes the RC delay becomes the dominant factor to impact IC performance. The RC delay is a function of the product of the total resistance and capacitance of the whole interconnects structure. To reduce RC delay, copper interconnects were introduced to replace aluminum. At the same time, the low K material has been widely...
Currently, there is a great interest in applying copper material to wire bonding of fine pitch assembly packaging, particularly for cost saving purposes. However, the hardness property of copper is harder compared to the conventional gold wire. The hardness factor of copper, coupled with the work hardening effect of the USG power and force during wire bonding, is a major cause for bond pad crack and...
Wire bonding is the most applied technology to realize an electric chip-to-package interconnection and to provide electrical paths from and to the substrate for power and signal distribution. Established in the 1970s, wire bonding has been well documented and researched as a result of continuous process improvement and through the development of sophisticated, automated equipment over the years, [1-2].
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.