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The adoption of lead-free solders accelerates interfacial reaction because they have higher melting points and higher Sn content than the conventional Pb-Sn solders. In this work, we developed a ternary electroless Ni-W-P (6∼7 wt.% P, and 15∼16 wt.% W) alloy to be used as the soldering metallization due to its good thermal stability. Comparison was made with the results obtained from the conventional...
Wide bandgap materials have become very attractive for power electronics due to their physical properties that allow junction temperatures up to a theoretical limit of 600°C. In contrast, the maximum operation temperature of conventional silicon semiconductors is limited to approximately 200°C. The high-temperature operation of wide bandgap switches allows an increasing power density of power converters...
The drawback of Sn/Ag/Cu solder alloy on selective Ni/Au plating (SMOBC) TBGA substrate is weakened solder joint, which promote the embrittlement and affects long-terms reliability. The ability of electronic packages and assemblies to resist ball drop failure is becoming a growing concern recently. In this paper, test vehicles of Sn-Ag-Cu (SAC) solder alloys with different Ni thickness of 3, 5, 8...
Reballing involves removing the original solder balls and attaching new solder balls on the pads of ball grid array components. In this study, 676 I/O BGAs with Sn3.0Ag0.5Cu (SAC305) balls were reballed with eutectic tin-lead solder. The original metallization of the pads on the BGAs was Cu/Ni with immersion Au. Two solder ball removal methods were applied: the low-temperature wave solder method and...
Currently, there is a great interest in applying copper material to wire bonding of fine pitch assembly packaging particularly to improve reliability through minimizing the deterioration of bonded ball shear strength after thermal aging as well as cost saving purposes. However, since copper is much harder than gold, coupled with the work hardening effect of the USG power and force during wire bonding...
In the present work, Kirkendall void formation and drop impact reliability between Pb-free solder and Cu metallization were investigated. Pb-free solders, Sn-3.5 Ag and Sn-3.5 Ag-xZn (x=0.1, 0.5, 1, 3, and 7 wt%), were reacted with Cu metallization. After thermal aging of Sn-Ag solder on electrodeposited Cu at 150degC, Kirkendall voids were distributed either in the Cu3Sn layer or at the Cu/Cu3Sn...
The alloying of Al interconnects with Cu has been shown [1] to give a vast improvement in electromigration performance over pure-Al interonnects. In the work presented here it has been demonstrated that there is an optimum degree of Cu distribution at which the resistance to electromigration of an aluminium-copper alloy metallization can befur-ther enhanced. This microstructure is achieved using a...
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