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In this study, varying amounts of Ni-CNTs were incorporated into the Sn-Ag-Cu matrix to form the composite solders. The interfacial intermetallic thickness formed on the Ni/Au metallized Cu substrate was determined under the as-soldered and isothermally aged (at 150°C for up to 42 days) conditions. The results of the interfacial intermetallic thickness showed that for the case of the unreinforced...
For high temperature automotive application, IC products are required to pass stringent high temperature storage stress test (e.g. 5000hrs at 150 deg C), hence requires reliable wire bonds. Such requirement is especially challenging with fine pitch Au & Cu wire bond (e.g. bond pad pitch <; 70um and bonded ball diameter <; 58um), more-so on low k wafer technology with bond-over-active requirement...
In this study, we would analyzed the solid state reaction between Sn2.5Ag solder bump and Cu/Ni under-bump-metallization (UBM). After 150°C thermal aging, we observed that the intermetallic compounds (IMCs) at chip side and interposer side both were Ni3Sn4 IMCs. It indicated that the solder did not react with Cu and the Cu layer was completed. As thermal aging time increased, the thickness of Ni3Sn...
The Ni/95Pb5Sn/Cu ternary diffusion couples were used to investigate the cross-interaction between Ni and Cu across a layer of 95Pb5Sn solder. High-lead solder layers with thickness of 100 or 400 μm was electroplated over Cu foils. A pure Ni layer (20 μm) was then deposited over the as-deposited high-lead solder surface. The diffusion couples were then aged at 150 to 250°C for different periods of...
The line-type Cu/Sn/Ni interconnects were used to determine the effect of electromigration (EM) on the Cu-Ni cross-interaction under the current density of 1.0×104 A/cm2 at 150 °C for 100 h and 200 h. For the purpose of comparison, the line-type Cu/Sn/Ni interconnects were also aged at 150 °C for 100 h and 200 h. After soldering, Ni3Sn4 and Cu6Sn5 IMCs formed at the Sn/Ni and Sn/Cu interfaces, respectively...
The formation and growth of intermetallic compounds (IMC) is a key factor to the reliability of soldering joints in modern electronic mounting and packaging industry. In this paper, by means of Olympus, scanning electron microscope (SEM) and Energy Dispersive X-ray (EDX) analysis methods, the morphology and growth mechanisms of IMCs between SAC305-xNi and Cu joint during soldering as well as aging...
The η-η' transformation of interfacial Cu6Sn5 in solder joints was studied. Two cooling rates were selected to obtain different grain sizes of intermetallic compounds (IMCs). In the case of air cooling, the compounds were tiny and no η-η transformation was detected in the as-soldered state. Under furnace cooling, however, thick and coarse interfacial IMCs were obtained and η was still stable. After...
The precipitation behavior of Cu-Fe alloys with Ni addition on isothermal annealing at 878 K was investigated by means of transmission electron microscopy (TEM) and SQUID measurements. Nano-scale coherent particles were randomly formed at the initial stage of the precipitation process. The ordering trend was outstanding that two or more nano-scale particles cubic in shape are linearly aligned at later...
It is of importance for the reliability of lead-free and lead-bearing solder joints to have better understanding and control of the solder/metallization interactions during soldering. In the reactions between solders and Cu substrate, the formation of micro voids within the Cu3Sn layer had been report by many research groups. Because the Cu3Sn growth had been linked to the formation of micro voids,...
Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
Much literature has been written and debated on the effects of reflow profiles on IMC {Inter-metallic compound) formation for solder alloys and the diffusion of elements during this process. This data has been concerning primarily assembly operations. However, not much data has been acquired on the effects of thermal aging on solders at back end pre-pack operations. The thermal aging conducted at...
SnPb solder joints are an essential part for microelectronic packages manufacturing industrial for a long time. In recent year, environmental concerns and RoHS (Restriction of Use of Hazardous Substances) has demanded elimination of lead from electronics products by July 1, 2006. However, base on increasing pressures to achieve environmentally friendly electronic materials and processes, and indeed,...
In this study, Sn3.0Ag0.5Cu solder bump was jointed on Ni(V)/Cu UBM and then aged at 125 degC for 500-2000 h. The heat treatment samples were employed to investigate the interfacial reaction and the mechanical properties between solder and UBM. (Cu,Ni)6Sn5 IMC formed at the interface between solder and Ni(V) layer after assembly. The thickness of (Cu,Ni)6Sn5 gradually increased to 4 mum during aging...
To enhance the ability of lead-free solder joint to resist failures induced by mechanical impact and shock, some researchers have introduced low-Ag lead-free solder. In this study, the formation and evolution of IMC, the fracture morphology and performance of solder joint between SAC 105 solder and Under Bump Metallization (UBM) have been studied after different temperature storage aging and multi-reflow...
The effects of the fourth Ni element on microstructure and monotonic shear strength of Sn-3.0Ag-0.5Cu lead-free solder were investigated. The addition of the Ni element makes the new (CuxNi1-x)6Sn5 phase, which improves the solder microstructure. The results indicate that the addition of Ni element increases the shear strength of solder joint. When the content of Ni is 0.10 wt.%, the shear strength...
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