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Wide bandgap materials have become very attractive for power electronics due to their physical properties that allow junction temperatures up to a theoretical limit of 600°C. In contrast, the maximum operation temperature of conventional silicon semiconductors is limited to approximately 200°C. The high-temperature operation of wide bandgap switches allows an increasing power density of power converters...
Bi element addition effects on Sn-0.3Ag-0.7Cu low-Ag solder properties are studied in this work. Solder alloy with different Bi adding amount, Sn-0.3Ag-0.7Cu-XBi (X = 0, 1.0, 3.0, 4.5), were fabricated. The melting point, wettability, and strength tests were carried out to find the effects of Bi addition on current low-Ag solder. Thermal aging of the solder interconnects with different Bi addition...
The influence of the standoff height, pad size and isothermal aging on the microstructure and shear fracture behavior of Cu/Sn-3.0Ag-0.5Cu/Cu BGA structured interconnects were investigated using the lap-shear test. The experimental results show that the thickness of intermetallic compounds (IMC) layer at the solder/Cu interface increases with decreasing standoff height of the joints. The size of Kirkendall...
Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints. It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions. In this paper, mechanical properties of two...
Copper and gold ball bonds were bonded on 1.2 μm thick Al-0.5%Cu-1%Si. One set of devices was aged at 175°C up to 1000 hours. A second set of devices was pre-conditioned for 168 hours at 85°C and 85% relative humidity followed by ageing at 175°C up to 1000 hours. No cratering was found with either wire in as-bonded devices but devices bonded with copper developed cratering after ageing. Neck and stitch...
In the present study, the interaction between thin film Cu and non-eutectic Sn-In is studied. The effects of the bonding and aging temperature on microstructure, IMC formation and also shear strength are investigated by SEM/EDX, XRD and shear testing. The bonding mechanism is proposed based on the obtained results. The bonding mechanism is proposed to occur over 2 stages: (1) An increase in bonding...
The morphological features and growth kinetics of interfacial IMCs have shown significant effect on the mechanical properties, and hence, on the reliability of lead free solder joints. The growth behavior of the interfacial IMCs of SnAgCu/Cu solder joint, in reflow and thermal cycling, was investigated with the focus on the influence of reflow dwell time and the cyclic parameters on the growth kinetics...
The drawback of Sn/Ag/Cu solder alloy on selective Ni/Au plating (SMOBC) TBGA substrate is weakened solder joint, which promote the embrittlement and affects long-terms reliability. The ability of electronic packages and assemblies to resist ball drop failure is becoming a growing concern recently. In this paper, test vehicles of Sn-Ag-Cu (SAC) solder alloys with different Ni thickness of 3, 5, 8...
The excessive growth of intermetallic compound (IMC) and the formation of microvoids in the interface between Sn-Ag-Cu (SAC) solder and Cu substrate have been a serious problem which may degrade the solder joints reliability. Recently, a new Cu-Zn alloy solder wetting layer for the Pb-free solders has been developed to reduce the IMC growth rate. In this paper, the kinetics of IMC growth and the shear...
Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
SiC power devices were die bonded to a AlN/Cu/Ni(Au) direct bonded copper (DBC) substrate with a Au-Ge eutectic solder in a vacuum reflow system. The long term joint reliability of the bonded chips was evaluated at 330degC in air for up to 1600 hours. The bonded samples were inspected with a micro focus X-ray TV system. The microstructure of the samples was observed and analyzed by the scanning electron...
In this paper, the effect of SiC nano-particles in micro-solder bump was investigated. SiC nano-particles were dispersed by using ultrasonic homogenizer in plating solution of eutectic Sn58Bi solder and codeposited in eutectic Sn58Bi solder bumps. Solder bumps were fabricated on patterned wafer. Prepared samples were aged for 100, 256 and 400 hrs at 100??C respectively, and then the observation of...
To meet the urgent demands of future electronic packages, the solder joints have to become increasingly miniaturized. Compared to the large solder joints, mechanics behavior for the samll solder joints is very different, resulting in a series of reliability issues. Therefore, it is very important to understand the mechanics behavior of the small solder joints. In this paper, the shear test of the...
The effects of the fourth Ni element on microstructure and monotonic shear strength of Sn-3.0Ag-0.5Cu lead-free solder were investigated. The addition of the Ni element makes the new (CuxNi1-x)6Sn5 phase, which improves the solder microstructure. The results indicate that the addition of Ni element increases the shear strength of solder joint. When the content of Ni is 0.10 wt.%, the shear strength...
We recently developed Cu-Zn alloy wetting layer for the SAC solder balls to improve the reliability. In this paper, IMC formation and solder joint reliability have been investigated in the solder joint between SAC solder balls and Cu-Zn alloy pads, and Cu pads were also used as a reference. Sn-4.0Ag-0.5 Cu solder balls were used and the substrates were Cu and 80 wt% Cu-20 wt% Zn pads which were defined...
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