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In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
Intermetallic compounds (IMCs) that grow on the interface between the solder alloy and its bonding pads play a crucial role in the reliability of solder joints. It has been identified that the cracking around the IMC layer is the primary failure mode in lead-free solder joints. Therefore the mechanical behavior of the IMC has attracted great attentions. In this paper, mechanical properties of two...
Sporadic voiding within the interfacial Cu3Sn intermetallic compound (IMC) layer-sometimes referred to as ??Kirkendall voiding??-has been found to lead to degradation of solder joint reliability in board level, mechanical shock testing. It has been suggested that the voiding phenomenon is a result of the incorporation of organic impurities in the copper (Cu) deposit during electroplating. In the present...
The formation and growth of intermetallic compound layer thickness is one of the important issues in search for reliable electronic and electrical connections. Intermetallic compounds (IMCs) are an essential part of solder joints. At low levels, they have a strengthening effect on the joint; but at higher levels, they tend to make solder joints more brittle. If the solder joint is subjected to long-standing...
The morphological features and growth kinetics of interfacial IMCs have shown significant effect on the mechanical properties, and hence, on the reliability of lead free solder joints. The growth behavior of the interfacial IMCs of SnAgCu/Cu solder joint, in reflow and thermal cycling, was investigated with the focus on the influence of reflow dwell time and the cyclic parameters on the growth kinetics...
Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles...
In this paper, the interfacial reactions of Sn-8Zn-3Bi and Sn-8Zn-3Bi-0.3Cr solders with Cu pads and the growth of IMCs during long-term aging treatment were presented and discussed. Less than 3 mum Cu5Zn8 IMC layer was found at the Sn-8Zn-3Bi-(0.3)Cr/Cu during the reflow at 230degC for 1 min. During solid state aging treatment at 150degC for 4, 9, 16, 25 days, the Cu5Zn8 IMC grown up with the extension...
We recently developed Cu-Zn alloy wetting layer for the SAC solder balls to improve the reliability. In this paper, IMC formation and solder joint reliability have been investigated in the solder joint between SAC solder balls and Cu-Zn alloy pads, and Cu pads were also used as a reference. Sn-4.0Ag-0.5 Cu solder balls were used and the substrates were Cu and 80 wt% Cu-20 wt% Zn pads which were defined...
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