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Nowadays, nanoelectroctronic, electro-nanotechnologies environmental friendly products become the roadmap in industry. Hence, nanoscale of reinforcement into lead-free solder becomes more popular rather than the micro size of reinforcement. In this paper, Cobalt nanoparticles-reinforced Sn-Ag-Cu composite solders were prepared by thoroughly blending 0.75 wt% of cobalt nanoparticles with near eutectic...
Selective catalytic reduction (SCR) of nitrogen oxide (NO) technology has widely applied in a combustion process to decline the concentration of NO due to its impact on the environments concerns. In this study, mesoporous SBA-15 was used as support material to load Cu catalyst to undergo the DeNOx reaction by CO. Cu/SBA-15 catalyst were prepared by polyol method and investigated by XRD, TEM and FTIR...
Copper (Cu) wire bonding is getting more common as interconnections on aluminium (Al) bond pad metallization in microelectronics due to lower cost compared to gold wire bonding. The Cu-Al intermetallic compounds (IMC) growth in Cu ball bonds has been investigated by many researches but the understanding of the IMC phases is still incomplete and the impact to bond reliability know-how is limited. This...
The precipitation behavior of Cu-Fe alloys with Ni addition on isothermal annealing at 878 K was investigated by means of transmission electron microscopy (TEM) and SQUID measurements. Nano-scale coherent particles were randomly formed at the initial stage of the precipitation process. The ordering trend was outstanding that two or more nano-scale particles cubic in shape are linearly aligned at later...
In flip chip technology, the Ni(V)/Cu multi-metallic thin-films is a widely used under bump metallization (UBM), for doping 7 wt.% V into the Ni target can eliminate the magnetism of Ni during sputtering. It was noted that V in the Ni(V) layer did not react with solders and intermetallic compounds (IMC) during reflow and aging process, yet a Sn-rich phase, as the so-called "Sn-patch", would...
The microstructure of the eutectic SnBi/Cu interface was investigated by transmission electron microscopy (TEM). In-situ and ex-situ thermal aging were conducted to study the nucleation and growth of Cu3Sn and Cu6Sn5 on both polycrystalline and single crystalline Cu substrates. The growth kinetic analysis showed that although the growth of total IMCs (Cu3Sn + Cu6Sn5) was similar on single and polycrystalline...
Transmission electron microscopy (TEM) observations were carried out to investigate the microstructural evolution of SnBi/single crystal (100) Cu interface during reflow and solid-state aging process. It was found that there were two kinds of IMCs, Cu6Sn5 and Cu3Sn, at the interface after reflow. The Cu3Sn grains grew along [100] direction of Cu with columnar morphology. During aging, new triangle...
The microstructures of SnBi/Cu interconnect after reflow and its evolution during solid-state aging at 393 K were investigated using transmission electron microscopy (TEM). It was found that after reflow there were two kinds of intermetallic compounds (IMCs) - Cu6Sn5 and Cu3Sn in solder joint. Above these IMC layers there was a Bi-rich layer which consisted of discontinuous Bi particles. During solid...
The thermal stability of flip chip solder joints made with Al/Ni(V)/Cu-UBM and SAC-405 solder bumps on substrates with either electroless Ni(P)-immersion gold (ENIG) or Cu surface finish (Cu-SOP) was determined at 170C. On ENIG, the resistance changed by more than one order of magnitude after 400 hours of high temperature storage, whereas on Cu-SOP, no change in resistance was observed up to 2400...
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