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As the trend for semiconductor packaging is heading towards BGA and flip chip interconnection methods, the conventional wire bonding process still dominates the industry primarily due the flexibility of wire bonds. The reliability of the bonded wires is assessed through wire bond shear test. In this study, the effects of shear ram speed on the stress response of bonded wires during wire bond shear...
The Brewster window is a broadband window solution for H&CD applications. Its geometry is quite complex and involves brazing of diamond and copper, which have very different thermal expansion coefficients. In this paper, a study of its feasibility was carried out by FEM structural analyses.
The reliability of wire bond is very significant due to its function of providing interconnection and signal passage to the integrated circuit. Wire bond shear test are utilized to evaluate the reliability and bond strength of bonded wires. In this study, the wire bond shear test is simulated. The effects of shear tool height on the stress response of bonded wires are examined through simulation....
Hydrostatic stress of Cu damascene interconnects was calculated by using finite element method in the present work. The analytical work was performed to examine the distribution of hydrostatic stress and the effect of different line width in the Cu interconnects. Then a model of atomic diffusion was presented and used to calculate the size of stress-induced voiding according to result of hydrostatic...
This paper emphasizes the factors to be considered when designing power connectors used in the load and temperature tests of power transformers. External conductors used to perform load and temperature tests in transformers are referred as power connectors in this contribution. Electrical and thermal investigations of a single-phase shell-type, 300 MVA, 400 kV–21.5 kV power transformer connector were...
A previously developed simulation technique has been applied to the prediction of the location of tin whiskers, which create reliability problems, generated on electrodeposited tin plating on a copper lead frame. This multi-scale simulation technique uses molecular dynamics simulation and a finite element method (FEM). The FEM model is used to simulate stress and stress-induced mass diffusion, including...
Comprehensive finite element analysis (FEA) modeling is carried out to improve the performance of critical designs of wafer level chip scale package (WLCSP). First, a design with one layer redistribution layout (RDL) copper with etched pocket in the non-covered UBM area and one layer polyimide structure (1Cu1Pi design) is investigated. Different polyimide layouts, copper thicknesses, pocket parameters...
An accurate estimation of losses becomes more and more important in the design process of permanent-magnet (PM) synchronous machines (PMSM). This estimation is also a key issue of thermal design. Therefore, the study of losses (in particular non-conventional losses) is of great importance. In this paper, the authors present a calculation of the stator windings and PMs losses for different types of...
Numerical methods such as the finite element method (FEM) have been used to evaluate the reliability of electronic packages. However, it is difficult to assure the accuracy of numerical analyses of electronic packages, which require nonlinear analyses. In this study, we evaluated the thermal strain of a test chip for three-dimensional stacked integrated circuits (3D SIC) with both measurement and...
Flip chip (fc) packaging has been practiced for many years but mainly for high end computer and certain automotive devices. RoHS has driven the conversion from lead-based fc bumps to lead-free (Pb-free) bumps. Pb-free was adopted more readily in consumer and mobile applications than in high reliability applications. A few years back, Intel introduced copper pillars (CuP) as an alternative to high...
A combined driving force model consisting of three driving forces is implemented for copper dual damascene line-via interconnects using finite element method. Good agreement is found between the experimental and computational results on the void volume at failure and time varying resistance change during electromigration stressing. The void evolution is also computed showing the process of the void...
The objective of this paper is to optimize the structural parameters of the Permanent Magnet Drive by minimizing the manufacturing costs while maintaining the output performance. The electromagnetic analysis of the Permanent Magnet Drive is carried out by the Finite Element Method. In order to debasing the cost of calculation and time, the rapid calculation model which can map the relationship between...
Non-linear finite element simulation by an elastic-viscoplastic constitutive model and the experimental characterization were carried out to investigate the volume effect of BGA structure solder joints under shear stress. A solder mask defined flat type copper pad of a circular opening 480 μm diameter and Sn3.0Ag0.5Cu (SAC) lead-free solder balls of 300–760 μm in diameter, were used to fabricate BGA...
In the last half a century, the complexity of electronic systems has undergone a sustainable rapid development stage following the Moore's law: the density of integrated circuits (ICs) was doubled every two years. As a result, electronic devices become more miniaturized in space and contain more power in unit volume. Electronic package has to deal with highly increased I/Os with fine soldering pitch...
The interior permanent magnet synchronous motor (IPMSM) is usually applied to the traction motor in the hybrid electric vehicle (HEV) and the electric vehicle (EV) due to its high-power density and wide speed range. In this paper, the IPMSM with concentrated winding for a 110cc electric motorcycle is introduced. In order to make the model operate correctly at high speed, optimization has to be performed...
In this paper, finite element modeling is performed to investigate the mechanisms ofreliability performance for wafer level packages (WLP) compared to chip scale ball grid array (BGA) packagesunder impact or drop loading conditions. Several scenarios are defined to reveal the different mechanisms of dynamic performance in WLP and BGA packages. Global/local finite element modeling is performed with...
With electronic production tending to be large scale integration, digital, lightweight, small-lot and diversification, the traditional bumping fabrication technologies aren't compatible with the electronic production such as the personalized, medical implants, military and new product development and so on for cost problem. And then the single chip bumping technology is introduced, among which the...
The common extruding method can only fabricate the finite length billet. However, the continuous extrusion forming (CONFORM) can realize the unlimited continuous extruding by the friction force generated from the relative movement between the squeegee roller and ingot. Furthermore, comparing with the common extruding method, the processing flow can be shortened and the efficiency can be improved with...
This paper intends to explain an evaluation procedure for ultra-wideband antenna elements for the SKA-AAlo. The authors will focus on low-cost in-house fabrication and testing of scaled prototypes as a first step before moving to RF anechoic chambers (techniques such as time gating will be explained). This is helpful for both software validation and in order to test the operational characteristics...
The optimization of grinding parameters for silicon wafers is necessary in order to maximize the reliability of electronic packages. This paper describes the work performed to simulate a back grinding process for Through Silicon Via (TSV) wafers using the commercial finite element code ABAQUS. The grinding of a TSV silicon wafer with a thickness of 120 μm mounted on a backing tape was simulated. The...
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