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The resistivity of a quasi-one-dimensional structure fabricated without masks by 20-keV Ga+ focused ion beam (FIB) on crystalline Si substrates was investigated for the first time, along with an analysis of properties of implanted p+ layers. The junction depth of the 7?? off-axis implanted layer after annealing, which was measured by stain method, is 410 nm. The distribution profile was investigated...
Thin film Ti/Pt heaters and temperature sensors were designed and fabricated to provide controlled heating of meandered microchannels realized on the opposite side of the Si platform. Ti/Pt heaters and temperature sensors were fabricated simultaneously by DC sputtering on SiO2/Si substrate. Annealing temperature in the range 400-700??C was found to influence significantly the sheet resistance and...
The paper presents a logic interconnect device (LED) to model digital circuit with near back-end-of-line (BEOL) effect, and to measure system performance. It is driven by a product inverter-based logic circuit, and it is loaded with near-BEOL wiring. The LID ring oscillator is measured and analyzed in 65 nm SOI CMOS. The methodology offers in-situ characterization of near-BEOL interconnect parasitics,...
In this paper, we study the impact of random discrete dopants in the source/drain (S/D) leads on the current variability of a gate-all-around Si nanowire transistor. Due to the strong inhomogeneities of the self-consistent electrostatic potential, a fully3Dreal-space nonequilibrium Green's function (NEGF) formalism is used. N-channel transistors with random discrete donors in the S/D regions varying...
After forty years of advances in integrated circuit technology, the scaling of Silicon Metal Oxide Semiconductor Field Effect Transistor (MOSFET) has entered the nanometer dimension with the introduction of 90 nm high volume manufacturing in 2004. Presently at 45 nm going to 32 nm node in 2009, the latest technological advancement has led to low power, high-density and high-speed generation of microprocessors...
As operating frequencies increase in state-of-the-art wireless designs, highly accurate modelling of critical interconnect paths routed over silicon is crucial for first-pass design success [1]. With this in mind, the interconnect stack of an IBM silicon germanium (SiGe) process incorporating a TSV ground supply network was modelled with model accuracy and efficiency as the goals. A unique modelling...
A simple, area and power-loss efficient, portable and robust ESD protection method for DC/DC converters is presented. The method is based on MOS transistors operating in normal mode, replacing the snapback based design methods. Measurement results of a prototype fabricated on silicon showed good agreement with simulation and are reported.
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