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Thinner organic BGA packages typically lead to higher warpage before surface mount which, after reflow, causes package corner solder joints (SJ) to have higher stand-off compared to solder joints in the package center. Hence the solder joints at package corners can change from typical barrel shape to an elongated hour-glass shape. Conventional understanding of the impact of SJ height on temperature...
As the use of ACFs increased in various areas of electronic packaging such as semiconductors and flexible devices, demands for highly reliable ACFs have been also increased. For this demand, solder ACFs which use solder particles as conductive particles were introduced. In the solder ACF bonding, the solder ACF joint morphology should be controlled because the failures of solder ACF joints by crack...
This study focuses on the development of a highly reliable solder bumping solution by the optimization of bump height and shape for flip-chip mounting of large die directly on PCB without the use of underfill. To achieve the goal, an elongated solder joint with an optimized shape has been developed that demonstrated far superior board-level thermo-mechanical reliability to that of the conventional...
This paper presents the design and prototype of a camera-orienting mechanism. Bioinspired actuators and mechanisms have been developed to pan and tilt a camera with comparable characteristics as a human eye. To meet the stringent space/weight requirement of robotic applications, a compact-orienting mechanism is proposed. We specifically aim at matching the size of a human eye. Through the arrangement...
This paper proposes a design and control method for high-speed parallel robot. Improvement of several components of a robot is conducted from the previously designed prototype and thus better performance can be achieved. Stress analysis is conducted to improve the stability and reliability of the newly designed parallel robot.
The combination of ANSYS and ADAMS can improve the precision of system simulation. In this paper, first, a cable-stayed space truss, consisting of stay cables, columns, and the space truss, is built in ANSYS. Second, the modal neutral file (mnf) needed in ADAMS is generated by executing the macro command “ADAMS” and then imported into ADAMS software. Third, the flexible body in the mnf file is connected...
The human femoral head is not a perfect sphere, but the artificial femoral head is made spherical due to simple manufacturing. The shape may significantly affect the mechanical characteristics of artificial hip joint. This paper is aiming at studying the shape effect of femoral head on mechanical behaviors of artificial hip joint. Three hip joint models with different shapes femoral head were proposed...
The acetabular cartilage is normally represented as a spherical shape in orthopedic clinic and related researches. The aim of the study was to present a new mathematic representation with better fit to the acetabular cartilage surface and to investigate the role of its shape on the hip joint contact stress. Combined with reverse engineering technique, surface-fitting algorithms and mathematical curve...
In order to increase the fatigue life of chip resistor, it is necessary to optimize the shape of solder joints. Shape and fatigue life of chip resistor solder joint were predicted by using finite element analysis methods. Through changing the solder volume, four typical solder joint shape prediction were conducted, and three-dimensional mechanical model of fatigue life analysis was set up. The distribution...
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