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Increasing I/O counts have led to ever decreasing cross sectional contact areas or, by default, an increase in solder performance expectations. A recognized measure of solder joint integrity is gained through High Speed Shear testing, (HSS). This article will statistically evaluate the solderability of the dominant final finishes with reference to some real life variables. The only skew is that only...
There is growing interest in Cu wire bonding for LSI interconnection due to cost savings and better electrical and mechanical properties. Conventional bare Cu bonding wires, in general, are severely limited in their use compared to Au wires. A coated Cu bonding wire (EX1) has been developed for LSI application. EX1 is a Pd-coated Cu wire to enhance the bondability. Bond reliability at a Cu wire bond...
In this study, Sn3.0Ag0.5Cu solder bump was jointed on Ni(V)/Cu UBM and then aged at 125 degC for 500-2000 h. The heat treatment samples were employed to investigate the interfacial reaction and the mechanical properties between solder and UBM. (Cu,Ni)6Sn5 IMC formed at the interface between solder and Ni(V) layer after assembly. The thickness of (Cu,Ni)6Sn5 gradually increased to 4 mum during aging...
Distributed software systems are characterized by increasing autonomy. They often have the capability to sense the environment and react to it, discover the presence of other systems and take advantage of their services, adapt and re-configure themselves in accordance with the internal as well as the global state. Testing this kind of systems is challenging, and systematic and automated approaches...
The work described here was carried out over several veal's. It resulted in the development of a Class F (155 °C) insulation system, as well as gained fundamental knowledge of turn insulation capabilities. The simulated service test described here was a basic part of this program and established itself as an outstanding tool for determining system performance. The detailed conclusions of this work...
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