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Increasing I/O counts have led to ever decreasing cross sectional contact areas or, by default, an increase in solder performance expectations. A recognized measure of solder joint integrity is gained through High Speed Shear testing, (HSS). This article will statistically evaluate the solderability of the dominant final finishes with reference to some real life variables. The only skew is that only...
The performance of the Au-Ge eutectic solder alloy and the Au-Si eutectic solder alloy at 300°C up to 500 h has been extensively reported. Coarsening of the dispersed (Ge) phase as well as the dissolution of the hard (Ge) phase into the soft (Au) matrix is observed during thermal aging. Shear testing and nano-indentation confirmed the loss of strength of the Au-Ge bulk solder during thermal aging...
The mechanical reliability of Sn-3.5 wt.%Ag solder joints with four different electroless Ni plating layers [Ni-1B, Ni-3B, Ni-7P, and Ni-10P (in wt.%)] was investigated as a function of aging time up to 60 days at 150?? C. The ultimate shear stresses for fracture were higher in the ball shear tests when using Ni-B samples than those with Ni-P metallization if the aging treatment at 150?? C was shorter...
The purpose of this study is to investigate the mechanical behavior of Sn-Ag-Cu solder joint under high speed shear test. A impact testing method with shear rate up to 1.0 m/s was set up to measure the solder joint reliability. The effects of differential substrate pad opening and pad metallization were also considered. The study focuses on failure mode analysis and examines characterizing strengths...
The aim of this research is to investigate the mechanical behavior of lead-free solder for high speed impact. A high speed impact test was set up to measure the solder joint reliability. Differential impact speed and room temperature aging effect has been studied with Ni/Au substrate. Furthermore, two different solder alloys (96.5Sn-3Ag-0.5Cu, 98.5Sn-1Ag-0.5C) and three different reflow profiles are...
Distributed software systems are characterized by increasing autonomy. They often have the capability to sense the environment and react to it, discover the presence of other systems and take advantage of their services, adapt and re-configure themselves in accordance with the internal as well as the global state. Testing this kind of systems is challenging, and systematic and automated approaches...
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