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Solder joints in electronic assemblies are often subjected to cyclic (positive/negative) mechanical strains and stresses. Such exposures can occur in variable temperature application environments or during accelerated life thermal cycling tests used for qualification. Cyclic loading leads to damage accumulation, crack initiation, crack propagation, and eventually to fatigue failure. In this investigation,...
Solder joints in electronic assemblies are typically subjected to thermal cycling, either in actual application or in accelerated life testing used for qualification. Mismatches in the thermal expansion coefficients of the assembly materials leads to the solder joints being subjected to cyclic (positive/negative) mechanical strains and stresses. This cyclic loading leads to thermomechanical fatigue...
Solder materials in electronic packages are often subjected to thermal cycling, either during their application in products or during accelerated life qualification testing. Cyclic temperatures cause the solder joints to be subjected to cyclic mechanical stresses and strains due to the mismatches in the thermal expansion coefficients of the assembly materials. Such loads lead to thermomechanical fatigue...
The object of this paper is to discuss the conditions which should be realized in the measurement of energy losses in sheet-iron and steel subjected to alternating magnetization, with a description of a modification of the Epstein method and apparatus. This method is believed better to satisfy the desired conditions and to give an accuracy of one per cent with the use of less than two kilograms (4...
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