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Reliability, availability, and maintainability (RAM) are three very important and necessary disciplines that must be applied within the system engineering process to ensure program success. The best way to generate success for a system is to overlay reliability engineering principles on the system engineering lifecycle, applying a phase-by-phase approach to drive RAM into the design. Beginning very...
The correlation of a statistical analysis tool to hardware depends on the accuracy of underlying variation models. The models should represent actual process behavior as measured in silicon. In this paper, we present an overview of test structures for characterizing statistical variation of process parameters. We discuss the test structure design and characterization strategy for calibrating random...
The impact of process variation on SRAM yield has become a serious concern in scaled technologies. In this paper, we propose a methodology to analyze the stability of an SRAM cell in the presence of random fluctuations in the device parameters. We provide a theoretical framework for characterizing the DC noise margin of a memory cell and develop models for estimating the cell failure probabilities...
Reliability failure mechanisms, such as time dependent dielectric breakdown, electromigration, and thermal cycling have become a key concern in processor design. The traditional approach to reliability qualification assumes that the processor operates at maximum performance continuously under worst case voltage and temperature conditions. However, the typical processor spends a very small fraction...
This work presents an analysis of a new type of composite transistor specially suited for the design of analog integrated circuits: the T-shape association of transistors. This association is composed by nonequal size unit transistors arranged in a series-parallel array with common gate, which can substitute the conventional rectangular transistors with advantages in some aspects, such as better high-frequency...
A systematic approach for modeling failure mechanisms on the circuit level and for using these models for optimization of both reliability and functionability is presented. Since optimization is done using a CAD system, it is possible to carry out such an optimization in a very early stage of the design process. The stress factors of the failure mechanisms are calculated using a circuit simulator...
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