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This paper presents the drop test results for edge and corner bonded 0.5 mm pitch lead-free package stackable very thin fine pitch ball grid arrays (PSvfBGAs) as package-on-package (PoP) bottom packages on a standard JEDEC drop test board. The test boards were dropped through an 1828.8 mm long, 110.0 mm diameter tube onto a steel plate. The daisy chain resistance of each PSvfBGA was measured by a...
The continuous push for smaller bump pitch interconnection in line with smaller Cu/low-k technology nodes demands the substrate technology to support finer interconnection. However, the conventional organic buildup substrate is facing a bottleneck in fine-pitch wiring due to its technology limitation, and the cost of fabricating finer pitch organic substrate is higher. To address these needs, Si interposer...
This paper describes the challenges of a 17.5um thin bare Cu wire bonding on aluminum bond pads for a fragile low-k wafer technology, on a BGA package. Previous evaluations have so far focused on 20um and 25um bare Cu wires as a suitable low cost replacement for Au wires. To improve performance, more fragile low-k wafer technology is being developed. In the past, some key technical challenges experienced...
Copper (Cu) wire has been highlighted as a low cost material for use in thermo sonic ball bonding for various package (PKG) groups. This wire has already been applied in high-end PKGs such as BGA, QFP and QFN in mass production, and the volume is feasible. Not only the advantage of a low cost material, but Cu wire has other merits which include higher electrical conductivity and a much slower intermetallic...
In this work, IMC (Inter metallic compound) of lead free (Sn-Ag-Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on the four kinds of surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) were investigated by Focus Ion Beam microscope (FIB). Sample after failure ageing conditions (Baking...
As high-speed, high-density, and high-performance are the primary IC development targets, packaging technologies play a key role to bring out the best performance of those ICs. In this paper, an active component formed by an active chip embedded technology is developed for the package of a high speed DDR2 memory device. Embedding of semiconductor chips into an organic substrate provide a solution...
Due to the increasing functional demand and miniaturization in high-density microelectronics packaging, thermomigration in flip chip solder joints owing to Joule heating becomes a serious reliability issue. In recent years, a series of researches have been devoted to examining the failure mechanism of thermomigration in eutectic SnPb and lead-free solder joints. However, only a few studies were focused...
The advanced QFN (aQFN) package is an enhanced version of conventional QFN (Quad Flat No-Lead) with multiple row terminals of featuring higher number of I/O ports. aQFN thermal and electrical performance are superior due to smaller profile, shorter interconnects. Also, the solder wettability control and board-level thermo-mechanical reliability are greatly enhanced over conventional QFN because of...
In today's electronic package development cycle, activities are managed by multiple participants in the supply chain which might have different quality and reliability impacts to the end product. As a result, the reliability risk is much higher for companies who do not have insight into and/or control over the products received. Design-for-Reliability (DFR) approaches will come into play to manage...
The cross sections of bonding have been made by using focus ion beam (FIB) system on the advanced chips packaged with BGA. Through the measurement of aluminum layer thickness under different bond force, the bonding reliability has been evaluated. The comparison has also been made on the interface of Au wire Bonding and Cu wire Bonding. Since the Cu wire Bonding process is more difficult, When it is...
Cure Induced Micro-Anomaly (CIMA) are worm like hollow microstructures found within resin rich region of underfill after curing within a BGA package with combination of copper die bumps and Sn-Ag substrate bumps. CIMA leads to solder extrusion during secondary reflow. Root cause of CIMA has been identified to be from thermal mechanical stress induced by the stiffness of the joints formed between the...
BGA device is always inefficient for its solder joints, of which part the interface intermetallic compounds (IMC) is most likely to crack. What's more, interfacial reactions are becoming more complex these days as the lead-free alternative becoming an urgent requirement for electronic industry and various materials being applied in electronics packaging application. Taking account of the above reasons,...
Experimental drop test results of 2nd-level assemblies can be influenced by numerous impact factors. The explicit definition of drop testing conditions by the JEDEC standard JESD22-B111 was intended to create a highly repeatable, and thus comparable, experimental setup. Recent developments showed, however, shifting failure modes from component to PCB side. Comprehensive drop tests were executed with...
This study serves to validate the predictive finite element modeling approach for the solder joint thermal fatigue life analysis, with emphasis on the applicability to various lead-free solder joints. The three packages involved in the study are 8??8 mm PBGA, l0??l0 mm QFN, and 51??51 mm CBGA. They are designed to consist of SAC387, SAC305, ??SAC305 ball + SAC387 paste?? and ??SAC387 ball + SAC305...
This paper presents the assembly optimization and characterization of through-silicon vias (TSV) interposer technology for two 8 ?? 10mm2 micro-bumped chips. The two micro-bumped chips represent different functional dies in a system-in-package (SiP). In the final test vehicle, one of the micro-bumped chips had 100??m bump pitch and 1,124 I/O; the other micro-bumped chip had 50??m bump pitch and 13,413...
As far as components with flip chip interconnects are concerned, one of the popular packaging solutions available in the market is thermally enhanced flip chip ball grid array (TEFCBGA) packages, which target mid to high performance applications. Traditional as it may be, the development of a reliable TEFCBGA package is still a very challenging task. The demands for high electrical performance with...
To eliminate the process of stacked with wire bonding interconnection technology, a through via silicon interposer which is used in stacked dies flip chip are assembled in this study currently. In this study, stack assembly process sequence and the sequence effect on solder joints formation 2nd level joints (between interposer chip and substrate) will be presented. 2nd level joints will be compared...
In this study, lead free (Sn-4Ag-0.5Cu (SAC)) and lead (62Sn-36Pb-2Ag (SP)) solder joint on various surface finished of ball grid array (BGA) pad, such as Immersion Tin (ImSn), Organic solderability preservatives (OSPs), Ni-P/Pd/Au (ENEPIG), and Ni-P/Au (ENIG) was investigated by its interface morphology and its physical properties. To evaluate the mechanical and physical properties of BGA pad with...
A complete halogen-free test vehicle was achieved by assembling five ball grid array (BGA) components with daisy-chain on an 8-layer high density interconnection (HDI) printed circuit board with a low-halide Sn1.0Ag0.5Cu (SAC105) Pb-free solder pastes for reducing the formation of Ag3Sn. Afterward a board-level cyclic bending test was enforced on the as-reflowed assemblies according to the JESD22-B113...
Ball grid array (BGA) solder interconnecting is one of the key technologies in electronic packaging and assembly. Legislation of lead-free process has made the application of lead-free solder become wider in electronic products. Compared to the lead-tin solder, the relatively higher melting points of most lead-free solders call for a higher reflow temperature. Thus conventional integral-heating process...
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