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Ring Oscillator (RO) Physical Unclonable Function (PUF) is one of the most popular silicon PUFs which exploit manufacturing variations during the chip fabrication process. RO PUF can generate secret bits by comparing the frequency difference between two ROs. However, previous RO PUFs improve flexibility and reliability through adding redundant ROs and thus incur unacceptable hardware overheads. In...
This work details a process-portable test chip, fabricated in 65nm CMOS, specifically designed to measure radiation-induced soft error rate (SER) during operation at near-threshold. A variety of SRAM, register file (RF), and digital logic test structures are included that provide a comprehensive assessment of circuit sensitivities to radiation at low VDD. Neutron irradiation measurements of SRAM/RF...
A new power gated 6T SRAM circuit is proposed in this paper to suppress leakage power consumption in data retention SLEEP mode. A new write assist circuitry is presented to enhance the write margin of the new power gated memory circuit. Design tradeoffs among data stability, power consumption, and write margin are evaluated with different SRAM circuits. The leakage power consumption is reduced by...
Nowadays RAMS (Reliability, Availability, Maintainability and Safety) standards are widely used in the contract for the procurement of railway vehicles in the world except Japan. In spite of this Japanese railway has good punctuality and reliability in its operation. The author points out a difference between Europe and Japan in the railway business through the investigation activity of onboard inverter...
This paper presents principles and results of dynamic testing of an SRAM-based FPGA using time- resolved fault injection with a pulsed laser. The synchronization setup and experimental procedure are detailed. Fault injection results obtained with a DES crypto-core application implemented on a Xilinx Virtex II are discussed.
We present a practical, systematical method for the evaluation of the soft error rate (SER) of microelectronic devices. Existing methodologies, practices and tools are integrated in a common approach while highlighting the need for specific data or tools. The showcased method is particularly adapted for evaluating the SER of very complex microelectronic devices by engineers confronted to increasingly...
This document presents a compilation of results from tests performed by iRoC Technologies on SER induced by alpha particles on SRAM memories for technology nodes from 180 nm to 65 nm. The aim of this study is to establish the variation of sensitivity with technology node for SEU and MCU, and to analyze the possible influence of different designs and technological parameters at a given technology node.
The soft-error vulnerability of flip-flops has become an important factor in IC reliability in sub-100-nm CMOS technologies. In the present work the soft-error rate (SER) of a 65-nm flip-flop has been investigated with the use of alpha-accelerated testing. Simulations have been applied to study the flip-flop SER sensitivity in detail. Furthermore, an easy-to-use approach is presented to make an accurate...
In this paper, we present a new technique to improve the reliability of H-tree SRAM memories. This technique deals with the SRAM power-bus monitoring by using built-in current sensor (BICS) circuits that detect abnormal current dissipation in the memory power-bus. This abnormal current is the result of a single-event upset (SEU) in the memory and it is generated during the inversion of the state of...
The minimum operating voltage (Vmin) of nano-scale LSIs is investigated, focusing on logic gates, SRAM cells, and DRAM sense amplifiers in LSIs. The Vmin that is governed by SRAM cells rapidly increases as devices are miniaturized due to the ever-larger variation of the threshold voltage (VT) of MOSFETs. The Vmin, however, is reduced to the sub-one-volt region by using repair techniques and new MOSFETs...
Continuous scaling, necessary for enhanced performance and cost reduction, has pushed existing CMOS materials much closer to their intrinsic reliability limits, forcing reliability engineers to get a better understanding of circuit failure. This requires that designers will have to be very careful with phenomena such as high current densities or voltage overshoots. In addition to the reliability issues,...
3D contactless technology based on capacitive coupling represents a promising solution for high-speed and low power signaling in vertically integrated chips. AC coupled interconnects do not suffer from mechanical stress, and the parasitic load is much reduced when compared to standard DC solutions, such as wire bonding and micro bumps. Communication system based on wireless interconnection scheme...
In deep submicron era, to prevent larger amount of SRAM from more frequently encountered overheating problems and react accordingly for each possible hotspots, multiple ideal run-time temperature sensors must be closely located and response rapidly to secure system reliability while maintaining core frequency. This paper presented a method to extract run-time temperature information from multiple...
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