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Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12”/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer size of...
Nowadays, Web-based learning become one of the most important components in educational technologies and has been widely employed in both educational and non-educational institutions. However, many of the Web-based learning systems are closed system and use private internal format. The learning materials may be dispersed and stored in database or on the server's file system, therefore the learning...
Hydrotalcite (HT) or hydrotalcite-like compounds (HTlc) are layered double hydroxides belonging to the class of anionic clays. The structure of these compounds are very similar to that of brucite, Mg(OH)2, where some of Mg2+ represented as [M(II)] are isomorphously replaced by Al3+ represented as [M(III)] and the net positive charge is compensated by the inter-layered exchangeable anion (An−).
Evaluation of the Ag3Sn intermetallic compounds in the solder joints is a difficult issue; so a new image processing technique is developed to give quantitative, numerical results for the grain structure. During the cooling phase of the soldering method, different grain structures could be generated with different cooling rates. It is worth quantifying the difference. The developed image processing...
Thermo-mechanical stress caused by the mismatch of coefficients of thermal expansion (CTE) and temperature variations remain a major concern for the reliability of semiconductor components. This issue is usually addressed by exposing the component to temperature cycling stress tests for a certain number of cycles, followed by e.g. scanning acoustic microscopy (SAM) to investigate delamination. Discussions...
In this paper the effects of chemical and electrical driving forces on the evolution of interfacial reaction layers in lead-free solder interconnections are discussed. Firstly, the effects of alloying and impurity elements on the driving forces for diffusion in the Cu-Sn system are analyzed. These results are then used to predict the subsequent changes in the intrinsic fluxes of the elements. It is...
The microstructure and Te distribution in Cu-25CrTe contact materials doped with 0.01, 0.6 and 2.0 pct Te respectively were investigated by TEM with an EDS system. Meanwhile the tensile strength of eight Cu-25CrTe contact materials at ambient temperature was measured. It is shown that Te atoms segregate at the interface of Cu/Cr phases in the Cu-25CrTe materials; a globular CrCu2Te 2 intermetallic...
Solder joint crack in thermal cycling on board (TCoB) for surface mount devices (SMD) is becoming more stringent in semiconductor market. Current TCoB literature mainly focuses on Finite Element Analysis simulation with ANSYS software to identify the most sensitive parameters affecting TCoB performance and estimating the solder fatigue life. By a given Driver Mosfet Power QFN, this paper is focusing...
Commercial antenna test chambers (anechoic) currently use polyurethane foam absorbers on chamber interiors to eliminate undesired radio-frequency (RF) reflections. While effectively absorbing microwave signals, polyurethane material particulates over time adding contaminants to clean rooms and reducing absorber lifetime. These absorbers also release toxic gas when operating under high temperatures...
HVDC transmission systems are being employed in many projects all over the world. In particular, the demand for long-distance HVDC power transmission lines is increasing to interconnect power grids between main land and island or wind farm grid connection. With such an increasing demand, it was required to develop new insulation materials suitable for the DC cables. The extruded insulation material...
The principal problem, which arises at construction of multibeam cathode units, is provision of small spread in emission parameters of separate emitters in the unit preserving the mechanical strength and the shape stability of the cathode unit. The problem is reduced to task of effective attachment of emitters to their seats in the holder of the unit.
Single crystals of a new compound of Zn(II) with pyridoxalaminoguanidine (PLAG), (PLAGH)2[ZnCl4] were obtained and transformed to the appropriate 5 mm diameter pellet. Another pellet of Ru(II) complex with bypiridine, i.e. tris(2,2'-bipyridine)ruthenium(II), of 10 mm diameter has been synthesized. Photoluminescence spectra were measured for both materials. Lorentzian multipeak technique was used to...
Fan-out Wafer Level Packaging (FOWLP) is one of the latest packaging trends in microelectronics. Mold embedding for this technology is currently done on wafer level up to 12"/300 mm size. For higher productivity and therewith lower costs larger mold embedding form factors are forecasted for the near future. Following the wafer level approach then the next step will be a reconfigured wafer diameter...
This paper focuses on the cooling rate of soldering process. Our target was to create a well-controlled equipment that is used to set the adjustable slope of the cooling curve with three special sections. The three sections are: near the melting point, above and below the melting point. The unit uses cooling fans to create a forced convection air flow. K-type thermocouple is used for the temperature...
Traditionally fan out wafer level package technology has been associated with lower power, smaller body sizes (typically < 8mm×8mm), small body-to-die size area ratios (<2) and fine pitch BGAs (0.4mm or less). This work extends this technology to larger body sizes up to 13mm × 13mm, higher powers, > 5W, and larger body-to-die size area ratios up to 10.5. It is shown that such packages can...
CuBO2 is prepared by a solid-state reaction method to investigate thermoelectric properties in high temperature. The XRD result confirms the CuBO2 compound existing in this method. The Seebeck reveals the compound displays p-type thermoelectric material. The experimental results of electrical resistivity exhibited results of 0.004 S/cm to 0.038 S/cm with the temperature range of 650 to 830 K. The...
An innovative approach of sensitive and selective detection of trace amounts of chemical threat agents is presented in this work. The technology deals with semiconductor metal oxide gas sensors as a means of express gas detection, coupled with pre-sampling system, which is to improve sensitivity and selectivity of analysis. Examples for H2S, DMMP (phosphor-organic weapons simulant) and UDMH (highly...
Low voltage circuit breakers in modern AC and DC networks should be capable of cut off operational as well as fault currents. An important influence factor for a successful current interruption is determined by the arc-attachment at the electrodes, supporting or limiting a quick arc-movement to the running-rails and towards the extinction chamber. This work presents experimental results of the investigation...
With the rapid growth of network technologies, Web-based learning conquers the limits of time and location in traditional teaching and is increasing its popularity. However, most of the learning websites lacks of the convenient tools in packaging the information users are interested in. Therefore, the information posted and exchanged in the websites is not easy to be extracted and reused somewhere...
Tensile specimens with a Cu/IMC/solder/IMC/Cu structure were prepared, and were treated by 0h, 72h, 168h, 288h, 500h, 1000h isothermal aging processing at 150°C. Quasi-static tensile tests were conducted on the micro-tester Instron5948, Fracture analysis of fractured specimens was conducted by optical microscopy and scanning electron microscopy. Two fracture modes were found, and the fracturing surface...
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