The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length...
Porous metals have always been meticulously studied as they have a bright prospect in the future due to their extremely large solid-fluid contact that enhances heat transfer medium and improves cooling density. In this study, X-ray (Computed tomography) μCT-Scanning usually employed in medical imaging was used on 1.0 cm3 porous copper sample to permit near-exact reconstruction of the sample to be...
An investigation is reported into the structure of Ball Grid Array/Permanent Stencil/Printed Circuit Board interconnects produced when semi-elastomeric bituminous stencils are formed or placed within standard interconnects. Such interconnects have the potential to extend the service life of Printed Circuit Boards especially for use in aviation, shipping and military applications.
Recent cloud computing communication strongly requires an order of magnitude higher bandwidth. For example, the maximum rate prescribed for SerDes and Interlaken is 28Gbps. This trend can be observed in new enterprise servers or enterprise routers. Boards and cards for enterprise devices are often relatively large, e.g., 300mm × 500mm, with more than 60 layers. Fine pitch wiring of over 300mm length...
Chitosan-gold nanocomposite has been synthesized by the Turkevich method and the final properties of nanocomposite have been investigated using electrical impedance spectroscopy, UV-vis spectroscopy, TEM and potentiometric measurements. We explore the possibility to detect copper ions using electrical impedance measurements in a linear range of 1–60 ppm, and using potentiometric measurements in a...
This article proposes the research and simulation of general bars of medium voltage metal enclosed switchgear, made of aluminum round bar with copper contacts, with a view to finding a similar or even more convenient solution than that of copper bars, both from a technical and economic point of view. The objective is heat distribution for current passing, in the bar and especially in contacts, under...
This paper mainly does a research on force and thermal phenomena of short circuited melted mark in electrical fire. The primary short circuited melted mark and secondary short circuited melted mark were prepared by the experiment, and were characterized by metallographic microscope, powder X-ray diffraction, scanning electron microscope and energy dispersive spectroscopy, the role of forces and heat...
In this paper a new approach to multi-objective design optimisation of a distribution transformer is proposed. It is based on a combined pattern search optimisation technique and the Taguchi methodology. The objective was to increase the transformer efficiency by reducing the total transformer loss, coupled with the aim to minimise the iron and copper mass, and hence to attain a new, more efficient,...
A simple testing procedure has been developed in order to investigate and screen the current interruption capability of vacuum interrupter contact materials. A synthetic circuit delivering adjustable AC currents, followed by a pulsed of 21 kV peak for 2 seconds has been used. The electrical tests has been developed to reproduce the conditions close to a fault current rated at 12 kV; only the recovery...
Different vacuum interrupters (VI) are equipped with Transversal Magnetic Field (TMF) contacts. Due to the current path, a transversal directed Lorentz-force is affecting the electric arc to move in a circular, in order to reduce the heat input and therefore the local erosion of the contact surface. The degree of the contact erosion is dependent on the local temperature of the arc root, which can...
The objective of this paper is to present the thermal and mechanical stress analysis of an additively manufactured induction motor for traction applications. The additive manufacturing process enables higher copper fill factors in the stator core of the machine and also improves the internal thermal conduction in the stator core. While a higher copper fill factor increases the machine power density,...
Following recent advances in medical ultrasound imaging modalities, almost all human tissues can currently be examined. However, there is one exception: the human skeleton. Recent results have shown that cortical bone behaves like an elastic waveguide [1] for this organ supporting the propagation of several guided modes, depending on the cortical waveguide thickness and elasticity, can propagate....
The paper presents measurement results for cathode spot (CS) velocity V under action of a tangential magnetic field on a clean surface (refined by preceding arcing) of the cathode made of cupper-chromium (CuCr30) composition in vacuum. Measurements were performed in the range of currents I = (30–250) A in arcs of different lengths, h = 2 mm and 4 mm. The induction of tangential magnetic field varied...
In this paper, tin whisker behaviour of electroplating tin coating was studied in different environments. Different thickness of electroplating tin coating on copper substrate had been tested. Two different environmental conditions had been applied :one temperature tests (70 °C)and one external force tests(70 °C /17.5N). The growth of tin whisker was studied by using scanning electron microscopy (SEM)...
Die to die interconnection in wirebonding process these days is just common in particular to the mature packages using Gold (Au) wire as mean for interconnection. With the intense market competition to deliver a much competitive cost of the products more manufacturers, sub-contractors and even IDM (integrated device manufacturing) are now inclined with the use of Copper (Cu) wire as an alternative...
To meet the requirements for future fine pitch and high-performance interconnects in advanced packaging, ICAs with nano-materials are attracting more and more interest due to their specific electrical, mechanical and optical properties. There has been extensive research on nano-conductive adhesives containing nanofillers such as nanoparticles, nanowires or carbon nanotubes. In this paper, copper nanoparticles...
The major factor defining the wear and tear in power electronic components is temperature swing. The paper presents an insight to failure mechanisms and the benefits that can be gained if a holistic approach considering devices, adequate design-in and advanced thermal management is considered.
Electromagnetic noise caused by high speed digital and radio frequency electronic devices can affect the normal operation of other devices within the same system and result in significant intra-system electromagnetic interference (EMI) problems. Conformal shielding is an emerging method to prevent EMI by using metallization techniques to coat a thin metal layer around the package. In this study, copper...
This paper documents the design of a low-cost RFID tag that is operable among metallic surfaces. The tag uses a loop type antenna that is small, flexible, and vialess. In addition, the design only requires low-cost, easy-to-obtain materials. The tag has been successfully tested on metal at 915MHz. Thus, the tag can be used in non-ideal settings or as surface mounts on metallic objects. Simulation...
Good control over beam and chemistry conditions are required to enable uniform delayering of advanced process technologies in the FIB. The introduction of newer, thinner and more beam sensitive materials have made delayering more complicated. We shall introduce a new chemistry for device delayering and present results from both Ga and Xe ion beams showing its improvement over existing chemistries.
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.