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IEEE Transactions on Electromagnetic Compatibility > 2017 > 59 > 5 > 1558 - 1564
IEEE Transactions on Microwave Theory and Techniques > 2016 > 64 > 12-1 > 4287 - 4297
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2016 > 6 > 6 > 886 - 896
IEEE Transactions on Very Large Scale Integration (VLSI) Systems > 2016 > 24 > 5 > 1636 - 1648
IEEE Transactions on Electron Devices > 2014 > 61 > 7 > 2503 - 2508
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2014 > 4 > 9 > 1489 - 1494
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2013 > 3 > 11 > 1891 - 1906
IEEE Transactions on Electromagnetic Compatibility > 2013 > 55 > 1 > 149 - 158
IEEE Transactions on Electron Devices > 2010 > 57 > 12 > 3405 - 3417
IEEE Transactions on Advanced Packaging > 2010 > 33 > 4 > 1072 - 1079
IEEE Transactions on Electron Devices > 2009 > 56 > 9 > 1873 - 1881
IEEE Transactions on Microwave Theory and Techniques > 2008 > 56 > 8 > 1954 - 1961
IEEE Transactions on Microwave Theory and Techniques > 2008 > 56 > 12-2 > 3217 - 3222
IEEE Transactions on Instrumentation and Measurement > 2007 > 56 > 2 > 221 - 225
IEEE Translation Journal on Magnetics in Japan > 1994 > 9 > 3 > 76 - 83
IEEE Translation Journal on Magnetics in Japan > 1992 > 7 > 6 > 484 - 488