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Electro Magnetic and Radio Frequency Interference (EMI/RFI) occur in mobile electronics as high functioning devices with multiple operating frequencies are packaged in dense form factors. The most fundamental protection is through metal shielding to produce a "Faraday Cage" (e.g. a metal box) [1], a structure that absorbs or reflects EMI/RFI and boosts performance. A simple and direct means...
Thin substrate manufacturing is one of the highest growth areas in electronics. Fragile substrates of 100um or less supported by a carrier until the process is complete and are removed by simple and reliable means. The demands for temporary bonding of electronics vary from rigid wafers, flexible films, to components with solder bumps. Substrate type, topography, thermal budget, processing, and removal,...
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