The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
Ultrasonic cleaner is a workhorse in all failure analysis labs for residue removal after decapsulation or etching. In this paper, we present a novel method of ultrasonic decapsulation, where acid mixture was used in conjunction with ultrasonic agitation and was discovered to provide exceptionally high quality preservation of the surface of the copper bond wires which exceeds the quality of laser decap...
Under non-optimized wafer probe and wire bonding conditions, pad cratering/interlevel dielectric (ILD) cracks may result in an electrical failure. The conventional procedures to analyse these failures include fault localization, optical inspection, SEM inspection and Focused Ion Beam cross-section, which can be very time consuming. In this paper, we introduce a method to detect these failure more...
Copper dendrites on a flip chip die was analysed by SEM/EDX, FIB and TEM. The dendrites were found to consist of two layers. The upper layer visible under optical and SEM inspection consist of a carbon rich copper compound. TEM analysis revealed another layer under this carbon rich layer that consist of copper, tin and lead compounds. A possible mechanism of dendrite formation due to an electrochemical...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.