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Fan-Out Wafer Level Packages (FOWLPs) and Fan-Out Panel Level Packages (FOPLPs) have been proposed for promising candidates of the advanced packages for multifunctional LSI with many I/O (input/output). FOPLP is expected to reduce the cost of FOWLP by improving the productivity per substrate. Dielectric materials for redistribution layers (RDLs) are one of the most important materials for FOPLPs....
Positive tone Photosensitive Polyimide B-stage sheet which was composed of transparent soluble polyimide, naphthoquinone diazide compound, thermal cross linker and solvent, was developed. We designed new polyimide structure and cross linker suitable for photosensitive polyimide sheet. The photosensitive sheet shows fine pattern formation capability as well as good thermal stability and mechanical...
Novel Low-temperature curable positive-tone photosensitive polyimides (posi-PSPIs) with high elongationhave been developed as dielectric layers for copperredistribution layers (RDLs). The posi-PSPIs show lowtemperature curable nature, strong adhesion to the copper RDLs and high chemical resistance for establishing multi RDLs by incorporating polyimides with cross-linkers and adhesion promoters. Also,...
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