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With the rapid growth in the mobile industry, Package-on-Package (PoP) technology has been widely adopted for the 3D integration of logic and memory devices within mobile handsets and other portable multimedia products. The PoP solution offers significant advantages, including increased density through stacking logic and memory devices in the same formfactor and a high degree of flexibility for variable...
Advanced flip chip packaging technology supports the next generation of products with increased die complexities. The increase in complexity and functionality has been driving the need to investigate fine-pitch interconnection technology with 3D integration. Recently, Package on Package (PoP) has emerged as the preferred 3D integration of logic processors and memory devices for mobile handsets and...
Due to rapid growth in the mobile industry, Package-on-Package (PoP) has been widely adopted for 3D integration of logic and memory devices within mobile handsets, and other portable multimedia products, etc. Typical PoP configuration includes a logic function in the bottom package while memory dice are assembled into the top package. The TMV solution is widely adopted to reduce package warpage, to...
Package-on-package (PoP) has been widely adopted for 3D integration of logic and memory within mobile handsets and other portable multimedia devices. Typical PoP solution is applied to logic processor as bottom package and memory device as top package. TMV® solution is being applied to reduce the warpage and achieve the fine pitch PoP and stable stacking performance. Currently, 0.4mm MIF(Memory Interface...
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