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Stacking technology is an approach to improve scalability of 2D network-on-chip systems. 3D stacking technology places multiple chips vertically, while silicon chips are stacked side-by-side on a silicon interposer layer in the 2.5D stacking technology. 2.5D stacking can solve many of the 3D stacking difficulties such as thermal problem. The cores in the processing element (PE) layer must have the...