Search results for: Tiesong Lin
International Journal of Applied Ceramic Technology > 19 > 2 > 1009 - 1016
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 20 > 18702- 18709
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 19 > 17972- 17985
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 16 > 15236- 15249
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 15 > 13855- 13868
Journal of Materials Science: Materials in Electronics > 2019 > 30 > 10 > 9171-9183
Materials & Design > 2018 > 137 > C > 47-55
Materials Letters > 2018 > 210 > C > 117-120
IEEE Transactions on Components, Packaging and Manufacturing Technology > 2017 > 7 > 12 > 2087 - 2094
Journal of the European Ceramic Society > 2017 > 37 > 15 > 4715-4725
Ceramics International > 2017 > 43 > 16 > 13530- 13540
Microelectronics Reliability > 2017 > 78 > C > 181-189
Journal of Materials Science: Materials in Electronics > 2018 > 29 > 1 > 232-243
Journal of the European Ceramic Society > 2017 > 37 > 13 > 4015-4023
Journal of the European Ceramic Society > 2017 > 37 > 8 > 2779-2786
Materials & Design > 2017 > 119 > C > 303-310
Journal of the European Ceramic Society > 2017 > 37 > 3 > 1073-1081
Journal of Electronic Materials > 2017 > 46 > 4 > 2003-2010
Journal of the European Ceramic Society > 2016 > 36 > 16 > 4065-4070
Journal of Alloys and Compounds > 2016 > 678 > C > 389-395