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This paper introduces a hybrid capacitive coupling interconnects (CCIs) array suitable for bumpless flip-chip 3-D integration. Inside the hybrid array, both single-ended and common-centroid differential CCIs are interleaved together to cancel the crosstalk among them. The crosstalk cancellation capability of its own allows CCIs to be placed closer and thus improves the area efficiency. A high gain...
With the encouragement from the Vice Chancellor, the number of UiTM students who signed up for Mandarin courses is increasing dramatically. To overcome the problems of logistics, insufficient contact hours, lack of target language environment and the need for a learning tool (courseware) that can capture and enhance learning motivation especially among learners that have no prior knowledge in Mandarin,...
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