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In semiconductor manufacturing for automotive as for many other industries, reliability tests are designed and implemented in order to predict failure rate in real life and applications. Physics-of-failure is used on the rejects observed in field and during the reliability tests to check them to stress the components as in life applications. Besides this qualitative study between field and reliability...
Conventionally, post-temperature cycling reliability tests, polyimide based Print Circuit Board (PCB) offer better solder ball joint reliability than FR4 based PCB. This paper illustrates that for FR4 materials, by applying suitable PCB stack & solder mask design, 1.5 to 2X increase in solder ball joint reliability can be achieved. Reliability improvement is supported by correlation of theoretical...
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