Search results for: Hongzhi Fu
Microelectronics Reliability > 2017 > 71 > Complete > 134-142
International Journal of Fatigue > 2016 > 87 > C > 216-224
Materials Chemistry and Physics > 2015 > 152 > Complete > 34-40
The European Physical Journal B > 2014 > 87 > 3 > 1-6
Journal of Alloys and Compounds > 2013 > 581 > Complete > 867-872
Intermetallics > 2013 > 42 > Complete > 156-164
Journal of Materials Science > 2013 > 48 > 12 > 4284-4296
Journal of Materials Science > 2012 > 47 > 18 > 6673-6678
Intermetallics > 2011 > 19 > 12 > 1959-1967
physica status solidi (b) > 248 > 5 > 1222 - 1226
Bulletin of Materials Science > 2011 > 34 > 7 > 1617-1625
Journal of Alloys and Compounds > 2010 > 506 > 1 > 22-26
Intermetallics > 2010 > 18 > 5 > 761-766
Physica B: Physics of Condensed Matter > 2010 > 405 > 3 > 846-851
physica status solidi (b) > 247 > 1 > 48 - 53
Solid State Communications > 2009 > 149 > 45-46 > 2110-2114
Physica B: Physics of Condensed Matter > 2009 > 404 > 20 > 3363-3367
Journal of Alloys and Compounds > 2009 > 480 > 2 > 587-591
Materials Chemistry and Physics > 2009 > 115 > 2-3 > 789-794
Journal of Alloys and Compounds > 2009 > 475 > 1-2 > 885-888